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A fast switching fast bridge using GaN transistors (2024)
Presentation / Conference Contribution
Marchant, S., & Empringham, L. (2024, December). A fast switching fast bridge using GaN transistors. Paper presented at 9th IEEE Southern Power Electronics Conference, Brisbane, Australia

This paper presents the design and evaluation of a half bridge based around off-the-shelf gallium nitride power devices and a bespoke printed circuit board. The necessary parasitic evaluation at the design stage was not straightforward due to the in... Read More about A fast switching fast bridge using GaN transistors.

Silicon Carbide n-IGBTs: Structure Optimization for Ruggedness Enhancement (2024)
Journal Article
Almpanis, I., Antoniou, M., Evans, P., Empringham, L., Gammon, P., Undrea, F., Mawby, P., & Lophitis, N. (2024). Silicon Carbide n-IGBTs: Structure Optimization for Ruggedness Enhancement. IEEE Transactions on Industry Applications, 60(3), 4251-4263. https://doi.org/10.1109/tia.2024.3354870

In recent years, silicon carbide (SiC) based devices are increasingly replacing their silicon counterparts in power conversion applications due to their performance superiority. SiC insulated-gate bipolar transistors are particularly interesting as t... Read More about Silicon Carbide n-IGBTs: Structure Optimization for Ruggedness Enhancement.

1.2 kV SiC Wirebond-Less Integrated Low Inductance Module for Automotive Application (2023)
Presentation / Conference Contribution
De Giorgio, M., Li, K., Marchant, S., de Lillo, L., Empringham, L., Serafianos, D., Lea, J., Brockway, S., & Johnson, M. (2023, November). 1.2 kV SiC Wirebond-Less Integrated Low Inductance Module for Automotive Application. Presented at 2023 IEEE 8th Southern Power Electronics Conference and 17th Brazilian Power Electronics Conference (SPEC/COBEP), Florianopolis, Brazil

In this paper, a 1.2 kV wirebond-less Silicon Carbide (SiC) Intelligent Power Module (IPM) designed for automotive applications is presented. This IPM includes integrated decoupling capacitors and gate drivers. By utilizing Printed Circuit Board (PCB... Read More about 1.2 kV SiC Wirebond-Less Integrated Low Inductance Module for Automotive Application.

Packaging for fast switching power electronics (2023)
Presentation / Conference Contribution
Marchant, S., Dai, J., Mouawad, B., Empringham, L., & Clare, J. (2023, November). Packaging for fast switching power electronics. Presented at 2023 IEEE 8th Southern Power Electronics Conference and 17th Brazilian Power Electronics Conference, Florianopolis, Brazil

This work investigates printed circuit board embedding of the power devices in order to support low inductance, fast switching package designs. The embedding process is discussed and a half bridge package is designed around a 500V supply voltage and... Read More about Packaging for fast switching power electronics.

10kV+ Rated SiC n-IGBTs: Novel Collector-Side Design Approach Breaking the Trade-Off between dV/dt and Device Efficiency (2023)
Journal Article
Almpanis, I., Evans, P., Antoniou, M., Gammon, P., Empringham, L., Undrea, F., Mawby, P., & Lophitis, N. (2023). 10kV+ Rated SiC n-IGBTs: Novel Collector-Side Design Approach Breaking the Trade-Off between dV/dt and Device Efficiency. Key Engineering Materials, 946, 125-133. https://doi.org/10.4028/p-21h5lt

10kV+ rated 4H- Silicon Carbide (SiC) Insulated Gate Bipolar Transistors (IGBTs) have the potential to become the devices of choice in future Medium Voltage (MV) and High Voltage (HV) power converters. However, one significant performance concern of... Read More about 10kV+ Rated SiC n-IGBTs: Novel Collector-Side Design Approach Breaking the Trade-Off between dV/dt and Device Efficiency.

A Topology-Morphing Series Resonant Converter for Photovoltaic Module Applications (2022)
Presentation / Conference Contribution
Sergentanis, G., De Lillo, L., Empringham, L., & Johnson, C. M. (2022, September). A Topology-Morphing Series Resonant Converter for Photovoltaic Module Applications. Presented at EPE 2022 ECCE Europe conference, Hannover, Germany

Residential solar photovoltaic (PV) installations frequently use power optimizers to increase their energy production. In this application, the ability to regulate a wide range of voltage with high efficiency is highly desirable. Thus, this paper pro... Read More about A Topology-Morphing Series Resonant Converter for Photovoltaic Module Applications.

Influence of Emitter Side Design on the Unintentional Turn-on of 10kV+ SiC n-IGBTs (2022)
Presentation / Conference Contribution
Almpanis, I., Antoniou, M., Evans, P., Empringham, L., Gammon, P., Udrea, F., Mawby, P., & Lophitis, N. (2022, October). Influence of Emitter Side Design on the Unintentional Turn-on of 10kV+ SiC n-IGBTs. Presented at 2022 IEEE Energy Conversion Congress and Exposition (ECCE), Detroit, MI, USA

Silicon Carbide (SiC) N-channel Insulated Gate Bipolar Transistors (n-IGBTs) rated higher than 10kV can improve Medium Voltage and High Voltage power electronics due to the favourable combination of SiC material with the nIGBT device structure. This... Read More about Influence of Emitter Side Design on the Unintentional Turn-on of 10kV+ SiC n-IGBTs.

Short-Circuit Performance Investigation of 10kV+ Rated SiC n-IGBT (2022)
Presentation / Conference Contribution
Almpanis, I., Gammon, P., Mawby, P., Evans, P., Empringham, L., Lophitis, N., Antoniou, M., & Udrea, F. (2022, September). Short-Circuit Performance Investigation of 10kV+ Rated SiC n-IGBT. Presented at IEEE Workshop on Wide Bandgap Power Devices and Applications in Europe (WiPDA-Europe 2022), Coventry, United Kingdom

This paper presents a comprehensive short-circuit robustness investigation of 4H- Silicon Carbide (SiC) n-type Insulated Gate Bipolar Transistors (nIGBTs) for Medium-Voltage and High- Voltage applications. Numerical electrothermal TCAD simulations ev... Read More about Short-Circuit Performance Investigation of 10kV+ Rated SiC n-IGBT.

Socio-Economic Benefits in Community Energy Structures (2022)
Journal Article
Kiamba, L., Rodrigues, L., Marsh, J., Naghiyev, E., Sumner, M., Empringham, L., de Lillo, L., & Gillott, M. (2022). Socio-Economic Benefits in Community Energy Structures. Sustainability, 14(3), Article 1890. https://doi.org/10.3390/su14031890

In this paper, the authors examine how a community energy group in the Meadows area of Nottingham in the UK adopted a model of local energy generation and storage as a means of combatting climate change, improving energy efficiency, enhancing energy... Read More about Socio-Economic Benefits in Community Energy Structures.

Automated design of integrated inductive components for DC-DC converters (2021)
Presentation / Conference Contribution
Stratta, A., Gottardo, D., di Nardo, M., de Lillo, L., Empringham, L., Espina, J., & Johnson, M. (2021, July). Automated design of integrated inductive components for DC-DC converters. Presented at 2021 IEEE Design Methodologies Conference (DMC), Bath, UK

A higher level of structural and functional integration of semiconductor devices, passive components, sensing, thermal management and control is considered fundamental to unlock wide band gap (WBG) devices full potential and ensure their reliable and... Read More about Automated design of integrated inductive components for DC-DC converters.

Optimal Integrated Design of a Magnetically Coupled Interleaved H-Bridge (2021)
Journal Article
Stratta, A., Gottardo, D., Nardo, M. D., Espina, J., Lillo, L. D., Empringham, L., & Johnson, M. C. (2022). Optimal Integrated Design of a Magnetically Coupled Interleaved H-Bridge. IEEE Transactions on Power Electronics, 37(1), 724-737. https://doi.org/10.1109/TPEL.2021.3094025

The application of wide-band gap semiconductors and their integration with other power electronics components (e.g., passives, gate drivers, sensing, thermal management) can meet the growing demand for volume reduction in power electronics systems. T... Read More about Optimal Integrated Design of a Magnetically Coupled Interleaved H-Bridge.

Heterogeneous Integration of Magnetic Component Windings on Ceramic Substrates (2020)
Journal Article
Stratta, A., Mouawad, B., Antonini, M., De Lillo, L., Empringham, L., & Johnson, M. C. (2021). Heterogeneous Integration of Magnetic Component Windings on Ceramic Substrates. IEEE Journal of Emerging and Selected Topics in Power Electronics, 9(4), 3867-3876. https://doi.org/10.1109/jestpe.2020.2989805

Heterogeneous integration and the converter in package concept have been highlighted as enabling technologies to unlock the full potential of silicon carbide (SiC) and gallium nitride (GaN) devices. Control of parasitic elements in the commutation lo... Read More about Heterogeneous Integration of Magnetic Component Windings on Ceramic Substrates.

Single Stage Dual Active Bridge AC-DC Converter with Active Power Decoupling (2018)
Presentation / Conference Contribution
Gottardo, D., De Lillo, L., Empringham, L., Costabeber, A., & Chen, L. (2018, June). Single Stage Dual Active Bridge AC-DC Converter with Active Power Decoupling. Presented at 2018 International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM), Amalfi, Italy

The paper introduces a new a isolated DC-AC DAB converter topology, capable of active power decoupling on the AC side of the transformer, made up of two full bridges with no additional active component. The differential voltage modulated by the DC-si... Read More about Single Stage Dual Active Bridge AC-DC Converter with Active Power Decoupling.

Matrix converter open circuit fault behavior analysis and diagnosis with a model predictive control strategy (2018)
Journal Article
Zhang, J., Dan, H., Empringham, L., De Lillo, L., & Wheeler, P. (2018). Matrix converter open circuit fault behavior analysis and diagnosis with a model predictive control strategy. IEEE Journal of Emerging and Selected Topics in Power Electronics, 6(4), 1831-1839. https://doi.org/10.1109/jestpe.2018.2856460

A novel fast and reliable open circuit fault diagnosis strategy for a Matrix Converter with a Finite Control Set Model Predictive Control strategy is proposed in this paper. Current sensors are located ahead of the clamp circuit to measure the output... Read More about Matrix converter open circuit fault behavior analysis and diagnosis with a model predictive control strategy.

IEEE ITRW working group position paper: packaging and integration: unlocking the full potential of wide-bandgap devices (2018)
Journal Article
Johnson, M., Wilson, P. R., Empringham, L., & De Lillo, L. (2018). IEEE ITRW working group position paper: packaging and integration: unlocking the full potential of wide-bandgap devices. IEEE Power Electronics Magazine, 5(2), 26-33. https://doi.org/10.1109/mpel.2018.2822246

The International Technology Roadmap for Wide-Bandgap Power Semiconductors (ITRW) has four distinct technical working groups, each providing its own perspective on the technology and industrial drivers for the adoption of wide-bandgap (WBG) power sem... Read More about IEEE ITRW working group position paper: packaging and integration: unlocking the full potential of wide-bandgap devices.

Cost effective direct-substrate jet impingement cooling concept for power application (2018)
Presentation / Conference Contribution
Mouawad, B., Abebe, R., Skuriat, R., Li, J., De Lillo, L., Empringham, L., Johnson, C. M., Roberts, A., Clarke, R., & Haynes, G. (2018, June). Cost effective direct-substrate jet impingement cooling concept for power application. Presented at PCIM 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management

Direct substrate jet impingement cooling can eliminate the use of the baseplate and significantly reduce the weight and volume of conventional thermal management solutions. This work demonstrates a cost-effective manufacturing approach based on print... Read More about Cost effective direct-substrate jet impingement cooling concept for power application.

Direct predictive current-error vector control for a direct matrix converter (2018)
Journal Article
Vijayagopal, M., Silva, C. A., Empringham, L., & De Lillo, L. (2019). Direct predictive current-error vector control for a direct matrix converter. IEEE Transactions on Power Electronics, 34(2), 1925-1935. https://doi.org/10.1109/TPEL.2018.2833495

This paper proposes a novel control strategy for matrix converters which is coined “Direct Predictive Current-error Vector Control”. The proposed control method retains the advantageous features of both a modulation scheme and of a predictive based c... Read More about Direct predictive current-error vector control for a direct matrix converter.

Novel silicon carbide integrated power module for EV application (2018)
Presentation / Conference Contribution
Mouawad, B., Espina, J., Li, J., Empringham, L., & Johnson, C. M. (2018, May). Novel silicon carbide integrated power module for EV application. Presented at WiPDA 2018 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia

The successful penetration of Electric Vehicles (EVs) into the global automotive markets requires the developments of cost effective, high performance and high integration power electronic systems. The present work is concerned with the structural in... Read More about Novel silicon carbide integrated power module for EV application.

Next generation integrated drive: a novel thermal and electrical integration technique for high power density converters used in automotive drive systems (2018)
Presentation / Conference Contribution
Ahmadi, B., Espina, J., De Lillo, L., Abebe, R., Empringham, L., & Johnson, C. M. Next generation integrated drive: a novel thermal and electrical integration technique for high power density converters used in automotive drive systems. Presented at 9th International Conference on Power Electronics, Machines and Drives (PEMD 2018)

In this paper, an innovative method of electro-thermal integration of a drive system is presented. Important challenges of this integration consist of, firstly coupled thermal design of switching power modules and PM electric motor and secondly integ... Read More about Next generation integrated drive: a novel thermal and electrical integration technique for high power density converters used in automotive drive systems.