IEEE ITRW working group position paper: packaging and integration: unlocking the full potential of wide-bandgap devices

Johnson, Mark; Wilson, Peter R.; Empringham, Lee; De Lillo, Liliana

Abstract

The International Technology Roadmap for Wide-Bandgap Power Semiconductors (ITRW) has four distinct technical working groups, each providing its own perspective on the technology and industrial drivers for the adoption of wide-bandgap (WBG) power semiconductors in power electronics. This article summarizes the progress toward an initial roadmap for the packaging and integration working group of the ITRW.

Citation

Johnson, M., Wilson, P. R., Empringham, L., & De Lillo, L. (2018). IEEE ITRW working group position paper: packaging and integration: unlocking the full potential of wide-bandgap devices. IEEE Power Electronics Magazine, 5(2), 26-33. https://doi.org/10.1109/mpel.2018.2822246

• Journal Article Type: Article
• Acceptance Date: Apr 26, 2018
• Online Publication Date: Jun 18, 2018
• Publication Date: Jun 18, 2018
• Deposit Date: Jan 9, 2019
• Publicly Available Date: Jan 10, 2019
• Journal: IEEE Power Electronics Magazine
• Print ISSN: 2329-9207
• Electronic ISSN: 2329-9215
• Peer Reviewed: Peer Reviewed
• Volume: 5
• Issue: 2
• Pages: 26-33
• DOI: https://doi.org/10.1109/mpel.2018.2822246
• Keywords: Control and Systems Engineering; Electrical and Electronic Engineering; Energy Engineering and Power Technology
• Public URL: https://nottingham-repository.worktribe.com/output/1459971
• Publisher URL: https://ieeexplore.ieee.org/document/8387491
• Contract Date: Jan 9, 2019