Packaging for fast switching power electronics

Marchant, Stewart; Dai, Jingru; Mouawad, Bassem; Empringham, Lee; Clare, Jon

Abstract

This work investigates printed circuit board embedding of the power devices in order to support low inductance, fast switching package designs. The embedding process is discussed and a half bridge package is designed around a 500V supply voltage and a 40A operating current using bare gallium nitride dies. Parasitic extraction from the computer aided design model predicted a commutation loop inductance of 1.95nH. The package was manufactured but the initial result was found not to function electrically. Misalignment between two of its component parts during fabrication was identified as the most likely cause. A solution to the fabrication problem was devised and tested. It is intended that an electrically functional package will be produced in the future.

Citation

Marchant, S., Dai, J., Mouawad, B., Empringham, L., & Clare, J. (2023). Packaging for fast switching power electronics. In 2023 IEEE 8th Southern Power Electronics Conference and 17th Brazilian Power Electronics Conference (SPEC/COBEP). https://doi.org/10.1109/SPEC56436.2023.10408379

• Presentation Conference Type: Edited Proceedings
• Conference Name: 2023 IEEE 8th Southern Power Electronics Conference and 17th Brazilian Power Electronics Conference
• Start Date: Nov 26, 2023
• End Date: Nov 29, 2023
• Acceptance Date: Aug 23, 2023
• Online Publication Date: Feb 1, 2024
• Publication Date: Nov 26, 2023
• Deposit Date: Mar 27, 2024
• Publicly Available Date: Apr 9, 2024
• Publisher: Institute of Electrical and Electronics Engineers
• Book Title: 2023 IEEE 8th Southern Power Electronics Conference and 17th Brazilian Power Electronics Conference (SPEC/COBEP)
• ISBN: 9798350321135
• DOI: https://doi.org/10.1109/SPEC56436.2023.10408379
• Public URL: https://nottingham-repository.worktribe.com/output/31435509
• Publisher URL: https://ieeexplore.ieee.org/document/10408379