The optimization of thermal performance in power electronics modules

Evans, Paul; Castellazzi, Alberto; Johnson, C. Mark; Lu, Hua; Bailey, Chris

Abstract

The development of a framework for the analysis and design optimization of power electronics module is described in this paper. This framework consists of analysis software that is capable of carrying out detailed dynamic as well as steady state electric and thermal analysis on power modules using finite difference numerical method and a black-box optimization solver that is based on the Mesh Adaptive Direct Search technique. Examples are given to show the application of the framework in the optimization of the thermal performance of a simplified module that consists of active semiconductor devices, ceramic substrate and baseplate.

• Conference Name: 2014 15th International Conference on Electronic Packaging Technology
• Conference Location: Chengdu, China
• Start Date: Aug 12, 2014
• End Date: Aug 15, 2014
• Online Publication Date: Oct 16, 2014
• Publication Date: 2014
• Deposit Date: Jun 24, 2024
• Publisher: Institute of Electrical and Electronics Engineers
• Pages: 734-739
• ISBN: 9781479947072
• DOI: https://doi.org/10.1109/ICEPT.2014.6922755
• Public URL: https://nottingham-repository.worktribe.com/output/35447564
• Publisher URL: https://ieeexplore.ieee.org/document/6922755