Outputs (906)

Mission Profile-Based Reliability Design and Real-Time Life Consumption Estimation in Power Electronics (2014)
Journal Article
Mussallam, M., Yin, C., Bailey, C., & Johnson, C. M. (2015). Mission Profile-Based Reliability Design and Real-Time Life Consumption Estimation in Power Electronics. IEEE Transactions on Power Electronics, 30(5), 2601-2613. https://doi.org/10.1109/TPEL.2014.2358555

Power electronics are efficient for conversion and conditioning of the electrical energy through a wide range of applications. Proper life consumption estimation methods applied for power electronics that can operate in real time under in-service mis... Read More about Mission Profile-Based Reliability Design and Real-Time Life Consumption Estimation in Power Electronics.

Condenser-free contrast methods for transmitted-light microscopy (2014)
Journal Article
Webb, K. F. (2014). Condenser-free contrast methods for transmitted-light microscopy. Journal of Microscopy, 257(1), 8-22. https://doi.org/10.1111/jmi.12181

Phase contrast microscopy allows the study of highly transparent yet detail-rich specimens by producing intensity contrast from phase objects within the sample. Presented here is a generalized phase contrast illumination schema in which condenser opt... Read More about Condenser-free contrast methods for transmitted-light microscopy.

Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects (2014)
Journal Article
Li, J., Castellazzi, A., Dai, T., Corfield, M., Solomon, A. K., & Johnson, C. M. (2015). Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects. IEEE Transactions on Power Electronics, 30(5), https://doi.org/10.1109/TPEL.2014.2357334

A stacked substrate–chip–bump–chip–substrate assembly has been demonstrated in the construction of power switch modules with high power density and good electrical performance. In this paper, special effort has been devoted to material selection and... Read More about Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects.

Multi-task control strategy for grid-tied inverters based on conservative power theory (2014)
Journal Article
Marafão, F. P., Brandão, D. I., Costabeber, A., & Paredes, H. K. (2015). Multi-task control strategy for grid-tied inverters based on conservative power theory. IET Renewable Power Generation, 9(2), https://doi.org/10.1049/iet-rpg.2014.0065

In recent years, the concept of decentralizing power generation through the deployment of distributed generators (DGs) has been widely accepted and applied, driven by the growing market of renewable energy sources, in particular photovoltaic, wind an... Read More about Multi-task control strategy for grid-tied inverters based on conservative power theory.

Assessing the accuracy of loss estimation methods for supercapacitor energy storage devices operating under constant power cycling (2014)
Presentation / Conference Contribution
Kulsangcharoen, P., Klumpner, C., Rashed, M., Asher, G., Chen, G. Z., & Norman, S. A. (2014, August). Assessing the accuracy of loss estimation methods for supercapacitor energy storage devices operating under constant power cycling. Presented at 2014 16th European Conference on Power Electronics and Applications (EPE'14-ECCE Europe), Lappeenranta, Finland

This paper assesses different energy loss estimation methods using the supercapacitor model parameters extracted from the electrochemical impedance spectroscopy (EIS). Two energy loss estimation methods are applied to two similar supercapacitors from... Read More about Assessing the accuracy of loss estimation methods for supercapacitor energy storage devices operating under constant power cycling.

Highly sensitive multipoint real-time kinetic detection of Surface Plasmon bioanalytes with custom CMOS cameras (2014)
Journal Article
Wang, J., Smith, R. J., Light, R. A., Richens, J. L., Zhang, J., O'Shea, P., See, C., & Somekh, M. G. (2014). Highly sensitive multipoint real-time kinetic detection of Surface Plasmon bioanalytes with custom CMOS cameras. Biosensors and Bioelectronics, 58, 157-164. https://doi.org/10.1016/j.bios.2014.02.042

Phase sensitive Surface Plasmon Resonance (SPR) techniques are a popular means of characterizing biomolecular interactions. However, limitations due to the narrow dynamic range and difficulty in adapting the method for multi-point sensing have restri... Read More about Highly sensitive multipoint real-time kinetic detection of Surface Plasmon bioanalytes with custom CMOS cameras.

Reliability of thick Al wire: a study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods (2014)
Journal Article
Arjmand, E., Agyakwa, P. A., & Johnson, C. M. (2014). Reliability of thick Al wire: a study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods. Microelectronics Reliability, 54(9-10), https://doi.org/10.1016/j.microrel.2014.07.119

The effect of bonding parameters on the reliability of thick Al wire bond is investigated. Samples were prepared with 25 different designs with 5 different bonding parameters such as time, ultrasonic power, begin- force, end-force and touch-down step... Read More about Reliability of thick Al wire: a study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods.

Overload robust IGBT design for SSCB application (2014)
Journal Article
Supono, I., Urresti, J., Castellazzi, A., & Flores, D. (in press). Overload robust IGBT design for SSCB application. Microelectronics Reliability, 54(9/10), https://doi.org/10.1016/j.microrel.2014.07.146

This paper presents an optimised power semiconductor architecture based on the CIGBT approach to be used in solid-state circuit breaker (SSCB) applications where the conduction losses have to be as low as possible without compromising the forward vol... Read More about Overload robust IGBT design for SSCB application.

Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles (2014)
Journal Article
Li, J., Johnson, C. M., Buttay, C., Sabbah, W., & Azzopardi, S. (2015). Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles. Journal of Materials Processing Technology, 215, 299-308. https://doi.org/10.1016/j.jmatprotec.2014.08.002

3 mm × 3 mm dummy SiC dies with 100\200\200 nm thick Ti\W\Au metallization have simultaneously been attached using sintering of Ag nanoparticle paste on AlN-based direct bonded copper substrates with 5\0.1 μm thick NiP\Au finish. The effect of prepar... Read More about Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles.

Built-in reliability design of a high-frequency SiC MOSFET power module (2014)
Presentation / Conference Contribution
Li, J., Gurpinar, E., Lopez Arevalo, S., Castellazzi, A., & Mills, L. Built-in reliability design of a high-frequency SiC MOSFET power module. Presented at 7th International Power Electronics Conference (IPEC Hiroshima 2014 ECCE- ASIA)

A high frequency SiC MOSFET-based three-phase, 2-level power module has been designed, simulated, assembled and tested. The design followed a built-in reliability approach, involving extensive finite-element simulation based analysis of the electro-t... Read More about Built-in reliability design of a high-frequency SiC MOSFET power module.