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Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles

Li, Jianfeng; Johnson, Christopher Mark; Buttay, Cyril; Sabbah, Wissam; Azzopardi, Stéphane

Authors

Jianfeng Li

MARK JOHNSON mark.johnson@nottingham.ac.uk
Professor of Advancedpower Conversion

Cyril Buttay

Wissam Sabbah

Stéphane Azzopardi



Abstract

3 mm × 3 mm dummy SiC dies with 100\200\200 nm thick Ti\W\Au metallization have simultaneously been attached using sintering of Ag nanoparticle paste on AlN-based direct bonded copper substrates with 5\0.1 μm thick NiP\Au finish. The effect of preparation and sintering parameters including time of drying the printed paste, sintering temperature and time, and pressure, on the average shear strength for multiple die attachments was investigated. The surfaces of the die attachments after the shear tests were observed and the individual shear strength values correlated with the “apparent” porosity and thicknesses of the corresponding die attachments (sintered layer). The results obtained are further discussed and compared with typical data reported in existing literature. Main conclusions include: (i) the present shear strength values and their variations are comparable with those reported for single die attachment samples, (ii) the effects of sintering parameters can be ascribed to the effectiveness of the organic content burnout and appropriate rate of growth and coalescence of the Ag nanoparticles during the sintering process, and (iii) thickness values of the sintered Ag die attachments may be taken as non-destructive measurements to monitor/evaluate the quality of die attachment during power electronic module manufacturing/assembly process.

Journal Article Type Article
Publication Date 2015-01
Journal Journal of Materials Processing Technology
Print ISSN 0924-0136
Electronic ISSN 0924-0136
Publisher Elsevier
Peer Reviewed Peer Reviewed
Volume 215
Pages 299-308
APA6 Citation Li, J., Johnson, C. M., Buttay, C., Sabbah, W., & Azzopardi, S. (2015). Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles. Journal of Materials Processing Technology, 215, 299-308. https://doi.org/10.1016/j.jmatprotec.2014.08.002
DOI https://doi.org/10.1016/j.jmatprotec.2014.08.002
Keywords Nanoscale silver paste; sintering; shear strength; SiC power die attachment
Publisher URL https://www.sciencedirect.com/science/article/pii/S0924013614002957?via%3Dihub
Copyright Statement Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by/4.0

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Copyright Statement
Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by/4.0





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