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Reliability of thick Al wire: a study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods

Arjmand, Elaheh; Agyakwa, Pearl A.; Johnson, C. Mark

Authors

Elaheh Arjmand eexea8@nottingham.ac.uk

MARK JOHNSON mark.johnson@nottingham.ac.uk
Professor of Advancedpower Conversion



Abstract

The effect of bonding parameters on the reliability of thick Al wire bond is investigated. Samples were prepared with 25 different designs with 5 different bonding parameters such as time, ultrasonic power, begin- force, end-force and touch-down steps (pre-compression) with 5 levels. The bond signals of ultrasonic generator were collected during bonding in order to obtain prior quality information of bonded wires. 3D x-ray tomography was then used to evaluate bond quality during passive thermal cycling between -55 °C and 125 °C. Tomography datasets were obtained from the as-bonded condition and during cycling. The results clearly show ultrasonic power, appropriate levels of begin-force and touch-down steps are all important for achieving a well attached and reliable bond. Analysis of the virtual cross-sections indicates a good correlation between the bond signal (i.e. the initial bond quality) and wire bond damage/ degradation rate. An improved understanding of the wire bonding process was achieved by observing the effect of the complex interaction of bonding parameters on the ultrasonic generator signals and degradation rate under thermal cycling.

Journal Article Type Article
Publication Date Sep 15, 2014
Journal Microelectronics Reliability
Print ISSN 0026-2714
Electronic ISSN 0026-2714
Publisher Elsevier
Peer Reviewed Peer Reviewed
Volume 54
Issue 9-10
APA6 Citation Arjmand, E., Agyakwa, P. A., & Johnson, C. M. (2014). Reliability of thick Al wire: a study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods. Microelectronics Reliability, 54(9-10), https://doi.org/10.1016/j.microrel.2014.07.119
DOI https://doi.org/10.1016/j.microrel.2014.07.119
Keywords Wire bonding process parameters, non-destructive methodology, reliability, x-ray tomography, passive thermal cycling, power electronic modules
Publisher URL http://www.sciencedirect.com/science/article/pii/S0026271414003217?np=y
Copyright Statement Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by-nc-nd/4.0

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Copyright Statement
Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by-nc-nd/4.0





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