Chip-on-board assembly of 800V Si L-IGBTs for high performance ultra-compact LED drivers
(2017)
Conference Proceeding
Aliyu, A. M., Mouawad, B., Castellazzi, A., Rajaguru, P., Bailey, C., Pathirana, V., …Udrea, F. (in press). Chip-on-board assembly of 800V Si L-IGBTs for high performance ultra-compact LED drivers.
This paper presents a novel chip on board assembly design for an integrated power switch, based on high power density 800V silicon lateral insulated-gate bipolar transistor (Si LIGBT) technology. LIGBTs offer much higher current densities (5-10X), si... Read More about Chip-on-board assembly of 800V Si L-IGBTs for high performance ultra-compact LED drivers.