Mark Cairnie
Reduce-Order Analysis and Circuit-Level Cost Function for the Numerical Optimization of Power Electronics Modules
Cairnie, Mark; DiMarino, Christina; Evans, Paul; Lophitis, Neophytos
Authors
Christina DiMarino
PAUL EVANS paul.evans@nottingham.ac.uk
Associate Professor
Dr NEO LOPHITIS NEO.LOPHITIS@NOTTINGHAM.AC.UK
Assistant Professor
Abstract
Energy innovation trends such as sustainable grids, and the electrification of the consumer transportation market are accelerating the adoption of medium-voltage (MV) silicon-carbide (SiC) technology. The fast switching times and higher operating temperatures enabled by MV SiC have forced package designers to employ innovative technologies to improve power densities, lower stray parasitics, and increase cooling capability. These new technologies ultimately require new simulation tools to allow for fast, efficient, and accurate computation of the multi-physics phenomena that govern package performance. To that end, this work proposes a multi-physics optimization workflow that utilizes reduced-order 3D package models and behavior circuit models to efficiently quantify the effects of the package on converter performance. A cost function is proposed which utilizes the information to optimize for converter performance, rather than individual package parameters.
Conference Name | 2021 IEEE 22nd Workshop on Control and Modelling of Power Electronics (COMPEL) |
---|---|
Conference Location | Cartagena, Colombia |
Start Date | Nov 2, 2021 |
End Date | Nov 5, 2021 |
Acceptance Date | Oct 1, 2021 |
Online Publication Date | Dec 23, 2021 |
Publication Date | Nov 2, 2021 |
Deposit Date | Jan 6, 2022 |
Publisher | IEEE |
Book Title | 2021 IEEE 22nd Workshop on Control and Modelling of Power Electronics (COMPEL) |
ISBN | 9781665436366 |
DOI | https://doi.org/10.1109/compel52922.2021.9645944 |
Public URL | https://nottingham-repository.worktribe.com/output/7169117 |
Publisher URL | https://ieeexplore.ieee.org/document/9645944 |
Additional Information | © 2021 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. |
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