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Reduce-Order Analysis and Circuit-Level Cost Function for the Numerical Optimization of Power Electronics Modules

Cairnie, Mark; DiMarino, Christina; Evans, Paul; Lophitis, Neophytos

Authors

Mark Cairnie

Christina DiMarino

PAUL EVANS paul.evans@nottingham.ac.uk
Associate Professor



Abstract

Energy innovation trends such as sustainable grids, and the electrification of the consumer transportation market are accelerating the adoption of medium-voltage (MV) silicon-carbide (SiC) technology. The fast switching times and higher operating temperatures enabled by MV SiC have forced package designers to employ innovative technologies to improve power densities, lower stray parasitics, and increase cooling capability. These new technologies ultimately require new simulation tools to allow for fast, efficient, and accurate computation of the multi-physics phenomena that govern package performance. To that end, this work proposes a multi-physics optimization workflow that utilizes reduced-order 3D package models and behavior circuit models to efficiently quantify the effects of the package on converter performance. A cost function is proposed which utilizes the information to optimize for converter performance, rather than individual package parameters.

Conference Name 2021 IEEE 22nd Workshop on Control and Modelling of Power Electronics (COMPEL)
Conference Location Cartagena, Colombia
Start Date Nov 2, 2021
End Date Nov 5, 2021
Acceptance Date Oct 1, 2021
Online Publication Date Dec 23, 2021
Publication Date Nov 2, 2021
Deposit Date Jan 6, 2022
Publisher IEEE
Book Title 2021 IEEE 22nd Workshop on Control and Modelling of Power Electronics (COMPEL)
ISBN 9781665436366
DOI https://doi.org/10.1109/compel52922.2021.9645944
Public URL https://nottingham-repository.worktribe.com/output/7169117
Publisher URL https://ieeexplore.ieee.org/document/9645944
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