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Analysis of device and circuit parameters variability in SiC MOSFETs-based multichip power module

Riccio, M.; Borghese, A.; Romano, G.; D 'alessandro, V.; Fayyaz, A.; Castellazzi, A.; Maresca, L.; Breglio, G.; Irace, A.

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Authors

M. Riccio

A. Borghese

G. Romano

V. D 'alessandro

ASAD FAYYAZ ASAD.FAYYAZ@NOTTINGHAM.AC.UK
Senior Research Fellow

A. Castellazzi

L. Maresca

G. Breglio

A. Irace



Abstract

In this contribution, a previously developed temperature-dependent SPICE model for SiC power MOSFETs is calibrated on experimental data of commercially available devices. Thereafter, its features are exploited for dynamic ET simulations of paralleled devices for multichip power module application. Finally, Monte Carlo ET simulations of paralleled devices during switching condition are used to evaluate the expected impact of statistical variation of device and circuit parameters on current sharing and on dissipated switching energy unbalance.

Citation

Riccio, M., Borghese, A., Romano, G., D 'alessandro, V., Fayyaz, A., Castellazzi, A., …Irace, A. (2018). Analysis of device and circuit parameters variability in SiC MOSFETs-based multichip power module. In Power Electronics and Applications (EPE'18 ECCE Europe), 2018 20th European Conference

Presentation Conference Type Conference Paper (Published)
Conference Name 20th European Conference on Power Electronics and Applications (EPE 18 ECCE Europe)
Start Date Sep 17, 2018
End Date Sep 21, 2018
Acceptance Date Jul 17, 2018
Online Publication Date Nov 1, 2018
Publication Date Sep 18, 2018
Deposit Date Feb 19, 2019
Publicly Available Date Feb 19, 2019
Publisher Institute of Electrical and Electronics Engineers
Book Title Power Electronics and Applications (EPE'18 ECCE Europe), 2018 20th European Conference
Public URL https://nottingham-repository.worktribe.com/output/1567038
Publisher URL https://ieeexplore.ieee.org/document/8515352
Additional Information © 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Contract Date Feb 19, 2019

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