Multi-Chip SiC MOSFET Power Modules for Standard Manufacturing, Mounting and Cooling

Castellazzi, Alberto; Fayyaz, Asad; Gurpinar, Emre; Hussein, Abdallah; Li, Jianfeng; Mouawad, Bassem

Abstract

Taking full advantage of the superior characteristics of SiC Power MOSFETs in the application requires the development of bespoke packaging solutions. Their design needs to thoroughly encompass electromagnetic and electro-thermal aspects to yield major system-level benefits. New design approaches are needed in particular for parallel multi-chip structures at higher voltage ratings. With the aim of enabling full exploitation of the disruptive potential of SiC technology, this paper proposes a review of learnings made in the development of SiC bespoke power modules, focusing in particular on module designs compatible with the most widely established manufacturing, converter assembly and thermal management solutions for large volume applications.

Citation

Castellazzi, A., Fayyaz, A., Gurpinar, E., Hussein, A., Li, J., & Mouawad, B. (2018). Multi-Chip SiC MOSFET Power Modules for Standard Manufacturing, Mounting and Cooling. In The 2018 International Power Electronics Conference - EECE Asia - IPEC 2018 (130-136). https://doi.org/10.23919/IPEC.2018.8507834

• Conference Name: 2018 International Power Electronics Conference (ECCE Asia-IPEC 2018)
• Conference Location: Niigata, Japan
• Start Date: May 20, 2018
• End Date: May 24, 2018
• Acceptance Date: Jan 10, 2018
• Online Publication Date: Oct 25, 2018
• Publication Date: May 20, 2018
• Deposit Date: Feb 19, 2019
• Publicly Available Date: Feb 19, 2019
• Publisher: Institute of Electrical and Electronics Engineers
• Pages: 130-136
• Book Title: The 2018 International Power Electronics Conference - EECE Asia - IPEC 2018
• ISBN: 9784886864055
• DOI: https://doi.org/10.23919/IPEC.2018.8507834
• Public URL: https://nottingham-repository.worktribe.com/output/1567421
• Publisher URL: https://ieeexplore.ieee.org/document/8507834
• Additional Information: © 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.