Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules
(2013)
Journal Article
Yang, L., Agyakwa, P. A., & Johnson, C. M. (2013). Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules. IEEE Transactions on Device and Materials Reliability, 13(1), https://doi.org/10.1109/TDMR.2012.2235836
This paper presents a review of the commonly adopted physics-of-failure-based life prediction models for wire bond interconnects in power electronic modules. In the discussed models, lifetime is generally accounted for by loading temperature extreme... Read More about Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules.