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Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules

Yang, Li; Agyakwa, Pearl A.; Johnson, C. Mark

Authors

Li Yang

Pearl A. Agyakwa

C. Mark Johnson



Abstract

This paper presents a review of the commonly adopted physics-of-failure-based life prediction models for wire
bond interconnects in power electronic modules. In the discussed models, lifetime is generally accounted for by loading temperature extremes alone. The influence of the time spent at temperature on bond wear-out behavior and damage removal phenomena resulting from thermally activated processes is not addressed. The phenomenological
considerations based on some unusual observations
highlight the need for new approaches to wire bond life prediction models and thus motivate the proposal of a new time-domain damage-based crack propagation model.

Journal Article Type Article
Publication Date Mar 1, 2013
Journal IEEE Transactions on Device and Materials Reliability
Print ISSN 1530-4388
Electronic ISSN 1530-4388
Publisher Institute of Electrical and Electronics Engineers
Peer Reviewed Peer Reviewed
Volume 13
Issue 1
APA6 Citation Yang, L., Agyakwa, P. A., & Johnson, C. M. (2013). Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules. IEEE Transactions on Device and Materials Reliability, 13(1), doi:10.1109/TDMR.2012.2235836
DOI https://doi.org/10.1109/TDMR.2012.2235836
Publisher URL http://ieeexplore.ieee.org/xpls/icp.jsp?arnumber=6392232
Copyright Statement Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by/4.0

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Copyright Statement
Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by/4.0





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