Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules

Yang, Li; Agyakwa, Pearl A.; Johnson, C. Mark

Abstract

This paper presents a review of the commonly adopted physics-of-failure-based life prediction models for wire
bond interconnects in power electronic modules. In the discussed models, lifetime is generally accounted for by loading temperature extremes alone. The influence of the time spent at temperature on bond wear-out behavior and damage removal phenomena resulting from thermally activated processes is not addressed. The phenomenological
considerations based on some unusual observations
highlight the need for new approaches to wire bond life prediction models and thus motivate the proposal of a new time-domain damage-based crack propagation model.

Citation

Yang, L., Agyakwa, P. A., & Johnson, C. M. (2013). Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules. IEEE Transactions on Device and Materials Reliability, 13(1), https://doi.org/10.1109/TDMR.2012.2235836

• Journal Article Type: Article
• Publication Date: Mar 1, 2013
• Deposit Date: Apr 17, 2014
• Publicly Available Date: Apr 17, 2014
• Journal: IEEE Transactions on Device and Materials Reliability
• Print ISSN: 1530-4388
• Electronic ISSN: 1530-4388
• Publisher: Institute of Electrical and Electronics Engineers
• Peer Reviewed: Peer Reviewed
• Volume: 13
• Issue: 1
• DOI: https://doi.org/10.1109/TDMR.2012.2235836
• Public URL: https://nottingham-repository.worktribe.com/output/1002779
• Publisher URL: http://ieeexplore.ieee.org/xpls/icp.jsp?arnumber=6392232