Packaging for fast switching power electronics
(2023)
Conference Proceeding
Marchant, S., Dai, J., Mouawad, B., Empringham, L., & Clare, J. (2023). Packaging for fast switching power electronics. In 2023 IEEE 8th Southern Power Electronics Conference and 17th Brazilian Power Electronics Conference (SPEC/COBEP). https://doi.org/10.1109/SPEC56436.2023.10408379
This work investigates printed circuit board embedding of the power devices in order to support low inductance, fast switching package designs. The embedding process is discussed and a half bridge package is designed around a 500V supply voltage and... Read More about Packaging for fast switching power electronics.