All Outputs (4)

Damage Evolution in Al Wire Bonds Subjected to a Junction Temperature Fluctuation of 30K (2016)
Journal Article

© 2016, The Author(s). Ultrasonically bonded heavy Al wires subjected to a small junction temperature fluctuation under power cycling from 40°C to 70°C were investigated using a non-destructive three-dimensional (3-D) x-ray tomography evaluation appr... Read More about Damage Evolution in Al Wire Bonds Subjected to a Junction Temperature Fluctuation of 30K.

Predicting Lifetime of Thick Al Wire Bonds Using Signals Obtained From Ultrasonic Generator (2016)
Journal Article

Routine monitoring of the wire bonding process requires real-time evaluation and control of wire bond quality. In this paper, we present a nondestructive technique for detecting bond quality by the application of a semisupervised classification algor... Read More about Predicting Lifetime of Thick Al Wire Bonds Using Signals Obtained From Ultrasonic Generator.

Quantification of cracked area in thermal path of high-powermulti-chip modules using transient thermal impedance measurement (2016)
Journal Article

Transient thermal impedancemeasurement is commonly used to characterize the dynamic behaviour of the heat flowpath in power semiconductor packages. This can be used to derive a “structure function”which is a graphical representation of the internal s... Read More about Quantification of cracked area in thermal path of high-powermulti-chip modules using transient thermal impedance measurement.

A thermal cycling reliability study of ultrasonically bonded copper wires (2016)
Journal Article

In this work we report on a reliability investigation regarding heavy copper wires ultrasonically bonded onto active braze copper substrates. The results obtained from both a non-destructive approach using 3D X-ray tomography and shear tests showed n... Read More about A thermal cycling reliability study of ultrasonically bonded copper wires.