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Predicting Lifetime of Thick Al Wire Bonds Using Signals Obtained From Ultrasonic Generator

Arjmand, Elahjeh; Agyakwa, Pearl; Corfield, Martin; Li, Jianfeng; Johnson, Christopher Mark

Authors

Elahjeh Arjmand

PEARL AGYAKWA PEARL.AGYAKWA@NOTTINGHAM.AC.UK
Anne Mclaren Research Fellow

Martin Corfield

Jianfeng Li

MARK JOHNSON MARK.JOHNSON@NOTTINGHAM.AC.UK
Professor of Advanced Power Conversion



Abstract

Routine monitoring of the wire bonding process requires real-time evaluation and control of wire bond quality. In this paper, we present a nondestructive technique for detecting bond quality by the application of a semisupervised classification algorithm to process the signals obtained from an ultrasonic generator. Experimental tests verified that the classification method is capable of accurately predicting bond quality, indicated by bonded area measured by X-ray tomography. Samples classified during bonding were subjected to temperature cycling between -55 °C and +125 °C, and the distribution of bond life amongst the different classes was analyzed. It is demonstrated that the as-bonded quality classification is closely correlated with thermal cycling life and can, therefore, be used as a nondestructive tool for monitoring bond quality and predicting useful service life.

Citation

Arjmand, E., Agyakwa, P., Corfield, M., Li, J., & Johnson, C. M. (2016). Predicting Lifetime of Thick Al Wire Bonds Using Signals Obtained From Ultrasonic Generator. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 6(5), 814-821. https://doi.org/10.1109/TCPMT.2016.2543001

Journal Article Type Article
Acceptance Date Feb 23, 2016
Online Publication Date Apr 8, 2016
Publication Date 2016-05
Deposit Date May 25, 2016
Publicly Available Date Jun 8, 2016
Journal IEEE Transactions on Components, Packaging and Manufacturing Technology
Electronic ISSN 2156-3985
Publisher Institute of Electrical and Electronics Engineers
Peer Reviewed Peer Reviewed
Volume 6
Issue 5
Pages 814-821
DOI https://doi.org/10.1109/TCPMT.2016.2543001
Keywords Electronics packaging; Forecasting; Nanocomposites; Quality control; Ultrasonic applications; Ultrasonic equipment; Ultrasonic waves; Wire
Classification methods; Non-destructive technique; Nondestructive tools; Quality classification; Real time evaluati
Public URL https://nottingham-repository.worktribe.com/output/976615
Publisher URL http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7450186
Additional Information 2016 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.

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