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Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator

Arjmand, Elahjeh; Agyakwa, Pearl; Corfield, Martin; Li, Jianfeng; Johnson, Christopher Mark

Authors

Elahjeh Arjmand eexea8@exmail.nottingham.ac.uk

Pearl Agyakwa pearl.agyakwa@nottingham.ac.uk

Martin Corfield martin.corfield@nottingham.ac.uk

Jianfeng Li eezjl@exmail.nottingham.ac.uk

Christopher Mark Johnson mark.johnson@nottingham.ac.uk



Abstract

Routine monitoring of the wire bonding process requires real-time evaluation and control of wire bond quality. In this paper, we present a nondestructive technique for detecting bond quality by the application of a semisupervised classification algorithm to process the signals obtained from an ultrasonic generator. Experimental tests verified that the classification method is capable of accurately predicting bond quality, indicated by bonded area measured by X-ray tomography. Samples classified during bonding were subjected to temperature cycling between -55 °C and +125 °C, and the distribution of bond life amongst the different classes was analyzed. It is demonstrated that the as-bonded quality classification is closely correlated with thermal cycling life and can, therefore, be used as a nondestructive tool for monitoring bond quality and predicting useful service life.

Journal Article Type Article
Publication Date May 1, 2016
Journal IEEE Transactions on Components, Packaging and Manufacturing Technology
Electronic ISSN 2156-3985
Publisher Institute of Electrical and Electronics Engineers
Peer Reviewed Peer Reviewed
Volume 6
Issue 5
APA6 Citation Arjmand, E., Agyakwa, P., Corfield, M., Li, J., & Johnson, C. M. (2016). Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 6(5), doi:10.1109/TCPMT.2016.2543001
DOI https://doi.org/10.1109/TCPMT.2016.2543001
Keywords Electronics packaging; Forecasting; Nanocomposites; Quality control; Ultrasonic applications; Ultrasonic equipment; Ultrasonic waves; Wire
Classification methods; Non-destructive technique; Nondestructive tools; Quality classification; Real time evaluati
Publisher URL http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7450186
Copyright Statement Copyright information regarding this work can be found at the following address: http://eprints.nottingh.../end_user_agreement.pdf
Additional Information 2016 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.

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Copyright Statement
Copyright information regarding this work can be found at the following address: http://eprints.nottingham.ac.uk/end_user_agreement.pdf





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