Preparation and characteristics evaluation of mono and hybrid nano-enhanced phase change materials (NePCMs) for thermal management of microelectronics

Arshad, Adeel; Jabbal, Mark; Yan, Yuying

doi:10.1016/j.enconman.2019.112444

All Outputs (5)

Development of TiO2/RT–35HC based nanocomposite phase change materials (NCPCMs) for thermal management applications (2020)
Journal Article

This experimental study covers the development of novel nanocomposite phase change materials (NCPCMs) based on RT–35HC as a phase change material (PCM) and titanium oxide (TiO2) as thermal conductivity enhancement material, for thermal management app... Read More about Development of TiO2/RT–35HC based nanocomposite phase change materials (NCPCMs) for thermal management applications.

A Model-based Tightly Coupled Architecture for Low-Cost Unmanned Aerial Vehicles for Real-Time Applications (2020)
Journal Article

This paper investigates the navigation performance of a vehicle dynamic model-based (VDM-based) tightly coupled architecture for a fixed-wing Unmanned Aerial Vehicle (UAV) during a global navigation satellite system (GNSS) outage for real-time applic... Read More about A Model-based Tightly Coupled Architecture for Low-Cost Unmanned Aerial Vehicles for Real-Time Applications.

Thermophysical characteristics and application of metallic-oxide based mono and hybrid nanocomposite phase change materials for thermal management systems (2020)
Journal Article

This experimental study covers the chemical, physical, thermal characterization and application of novel nanocomposite phase change materials (NCPCMs) dispersed by TiO2, Al2O3, and CuO nanoparticles for thermal management systems. A commercial-grade... Read More about Thermophysical characteristics and application of metallic-oxide based mono and hybrid nanocomposite phase change materials for thermal management systems.

Transient simulation of finned heat sinks embedded with PCM for electronics cooling (2020)
Journal Article

This paper reports the two-dimensional (2D) transient numerical simulation of a phase change material (PCM) based finned heat sink to investigate the heat transfer performance for passive cooling of electronic devices. The finned heat sinks of 2 mm a... Read More about Transient simulation of finned heat sinks embedded with PCM for electronics cooling.

Preparation and characteristics evaluation of mono and hybrid nano-enhanced phase change materials (NePCMs) for thermal management of microelectronics (2020)
Journal Article

Efficient, clean and quiet thermal management has become a vital challenge in for cooling of electronic devices. To enhance the capability and efficiency of passive thermal management , novel composite materials have been designed by the combination... Read More about Preparation and characteristics evaluation of mono and hybrid nano-enhanced phase change materials (NePCMs) for thermal management of microelectronics.