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Next generation integrated drive: a novel thermal and electrical integration technique for high power density converters used in automotive drive systems (2018)
Conference Proceeding

In this paper, an innovative method of electro-thermal integration of a drive system is presented. Important challenges of this integration consist of, firstly coupled thermal design of switching power modules and PM electric motor and secondly integ... Read More about Next generation integrated drive: a novel thermal and electrical integration technique for high power density converters used in automotive drive systems.

Differential buck single phase grid connected AC-DC converter with active power decoupling using a flipping Capacitor (2017)
Conference Proceeding

This paper introduces a new single-phase AC-DC converter capable of achieving independent voltage control across a dedicated power decoupling capacitor, by exploiting the same full bridge that controls the grid current in combination with two bidirec... Read More about Differential buck single phase grid connected AC-DC converter with active power decoupling using a flipping Capacitor.

Experimental comparison of devices thermal cycling in direct matrix converters (DMC) and Indirect Matrix Converters (IMC) using SiC MOSFETs (2016)
Conference Proceeding

This paper presents an experimental comparison between a Direct Matrix Converter and an Indirect Matrix Converter in terms of semiconductor devices thermal cycling. Both converters have been designed and built using SiC MOSFETs; the Indirect Matrix C... Read More about Experimental comparison of devices thermal cycling in direct matrix converters (DMC) and Indirect Matrix Converters (IMC) using SiC MOSFETs.