All Outputs (2)

1.2 kV SiC Wirebond-Less Integrated Low Inductance Module for Automotive Application (2023)
Conference Proceeding
De Giorgio, M., Li, K., Marchant, S., de Lillo, L., Empringham, L., Serafianos, D., …Johnson, M. (2023). 1.2 kV SiC Wirebond-Less Integrated Low Inductance Module for Automotive Application. In 2023 IEEE 8th Southern Power Electronics Conference and 17th Brazilian Power Electronics Conference (SPEC/COBEP). https://doi.org/10.1109/spec56436.2023.10408710

In this paper, a 1.2 kV wirebond-less Silicon Carbide (SiC) Intelligent Power Module (IPM) designed for automotive applications is presented. This IPM includes integrated decoupling capacitors and gate drivers. By utilizing Printed Circuit Board (PCB... Read More about 1.2 kV SiC Wirebond-Less Integrated Low Inductance Module for Automotive Application.

Packaging for fast switching power electronics (2023)
Conference Proceeding
Marchant, S., Dai, J., Mouawad, B., Empringham, L., & Clare, J. (2023). Packaging for fast switching power electronics. In 2023 IEEE 8th Southern Power Electronics Conference and 17th Brazilian Power Electronics Conference (SPEC/COBEP). https://doi.org/10.1109/SPEC56436.2023.10408379

This work investigates printed circuit board embedding of the power devices in order to support low inductance, fast switching package designs. The embedding process is discussed and a half bridge package is designed around a 500V supply voltage and... Read More about Packaging for fast switching power electronics.