Integrated Half-Bridge Switch Using 70- μm-Thin Devices and Hollow Interconnects

Solomon, Adane Kassa; Li, Jianfeng; Castellazzi, Alberto; Johnson, Christopher Mark

Abstract

An application-oriented integration concept for a half-bridge switch assembly has been developed based on the latest generation 70- μm-thin insulated gate bipolar transistors and diodes, which are rated at 600 V/200 A. This paper addresses the design and reliability of the assembly, with a fully bondwireless approach using cylindrical copper bumps. Advanced numerical structural simulation techniques are also applied to assess the influence of interconnect characteristics (material, size, and shape) and try to determine an optimum solution for reducing the stress and creep strain development in the solder joint. Preliminary experimental tests of the power module are also carried out at different switching frequency and loads to prove the validity of the proposed solution in terms of electromagnetic performance.

Citation

Solomon, A. K., Li, J., Castellazzi, A., & Johnson, C. M. (2015). Integrated Half-Bridge Switch Using 70- μm-Thin Devices and Hollow Interconnects. IEEE Transactions on Industry Applications, 51(1), 556-566. https://doi.org/10.1109/TIA.2014.2334734

• Journal Article Type: Article
• Acceptance Date: May 21, 2014
• Online Publication Date: Jul 8, 2014
• Publication Date: 2015-01
• Deposit Date: May 17, 2016
• Publicly Available Date: Jul 5, 2016
• Journal: IEEE Transactions on Industry Applications
• Print ISSN: 0093-9994
• Electronic ISSN: 1939-9367
• Publisher: Institute of Electrical and Electronics Engineers
• Peer Reviewed: Peer Reviewed
• Volume: 51
• Issue: 1
• Pages: 556-566
• DOI: https://doi.org/10.1109/TIA.2014.2334734
• Keywords: Bridges; Copper; Electronics packaging; Flip chip devices; Insulated gate bipolar transistors (IGBT); Power electronics; Application-oriented; Copper bumps; Electromagnetic performance; Experimental test; Flip chip; Solder joints; Structural simulations; Thermo-mechanical stress; Integrated circuit interconnects
• Public URL: https://nottingham-repository.worktribe.com/output/987567
• Publisher URL: http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6848776
• Additional Information: c2015 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.
• Contract Date: May 17, 2016