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Integrated Half-Bridge Switch Using 70- ?m-Thin Devices and Hollow Interconnects

Solomon, Adane Kassa; Li, Jianfeng; Castellazzi, Alberto; Johnson, Christopher Mark

Authors

Adane Kassa Solomon

Jianfeng Li

Alberto Castellazzi

MARK JOHNSON mark.johnson@nottingham.ac.uk
Professor of Advanced Power Conversion



Abstract

An application-oriented integration concept for a half-bridge switch assembly has been developed based on the latest generation 70- ?m-thin insulated gate bipolar transistors and diodes, which are rated at 600 V/200 A. This paper addresses the design and reliability of the assembly, with a fully bondwireless approach using cylindrical copper bumps. Advanced numerical structural simulation techniques are also applied to assess the influence of interconnect characteristics (material, size, and shape) and try to determine an optimum solution for reducing the stress and creep strain development in the solder joint. Preliminary experimental tests of the power module are also carried out at different switching frequency and loads to prove the validity of the proposed solution in terms of electromagnetic performance.

Citation

Solomon, A. K., Li, J., Castellazzi, A., & Johnson, C. M. (2015). Integrated Half-Bridge Switch Using 70- ?m-Thin Devices and Hollow Interconnects. IEEE Transactions on Industry Applications, 51(1), 556-566. https://doi.org/10.1109/TIA.2014.2334734

Journal Article Type Article
Acceptance Date May 21, 2014
Online Publication Date Jul 8, 2014
Publication Date 2015-01
Deposit Date May 17, 2016
Publicly Available Date Jul 5, 2016
Journal IEEE Transactions on Industry Applications
Print ISSN 0093-9994
Electronic ISSN 1939-9367
Publisher Institute of Electrical and Electronics Engineers
Peer Reviewed Peer Reviewed
Volume 51
Issue 1
Pages 556-566
DOI https://doi.org/10.1109/TIA.2014.2334734
Keywords Bridges; Copper; Electronics packaging; Flip chip devices; Insulated gate bipolar transistors (IGBT); Power electronics
Application-oriented; Copper bumps; Electromagnetic performance; Experimental test; Flip chip; Solder joints; Structural simulations;
Public URL https://nottingham-repository.worktribe.com/output/987567
Publisher URL http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6848776
Additional Information c2015 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.

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