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Laser ultrasound measurement of diaphragm thickness, Young’s modulus and Poisson’s ratio in a MEMS device

McKee, Campbell; Culshaw, Brian; Leach, Richard K.

Authors

Campbell McKee

Brian Culshaw

Richard K. Leach



Abstract

Laser-generated Lamb waves, coupled with a large bandwidth Michelson interferometer, have been demonstrated to accurately measure the thickness of a MEMS pressure sensor diaphragm in the [110] direction of a silicon wafer. Using the reassigned Gabor time-frequency method to produce group velocity dispersion curves, the technique facilitates the measurement of thickness, Young’s modulus and Poisson’s ratio from just one non-contact measurement. In this investigation, thickness was determined to be 35.01 μm ± 0.18 μm. For comparison, the thickness was measured using an independent optical technique; obtaining a value of 34.60 μm ± 0.27 μm. Values for Young’s modulus and Poisson’s ratio were also determined to be 163 GPa ± 11.7 GPa and 0.351 respectively and these are in good agreement with values found in the literature.

Citation

McKee, C., Culshaw, B., & Leach, R. K. (in press). Laser ultrasound measurement of diaphragm thickness, Young’s modulus and Poisson’s ratio in a MEMS device. IEEE Journal of Selected Topics in Quantum Electronics, https://doi.org/10.1109/JSTQE.2016.2635518

Journal Article Type Article
Acceptance Date Dec 2, 2016
Deposit Date Feb 21, 2017
Journal IEEE Journal of Selected Topics in Quantum Electronics
Print ISSN 1077-260X
Electronic ISSN 1558-4542
Publisher Institute of Electrical and Electronics Engineers
Peer Reviewed Peer Reviewed
DOI https://doi.org/10.1109/JSTQE.2016.2635518
Keywords Elastic modulus, Elasticity, Laser ultrasonics, Microelectromechanical systems (MEMS), Poisson’s ratio, Silicon, Young’s modulus
Public URL http://eprints.nottingham.ac.uk/id/eprint/40685
Publisher URL http://dx.doi.org/10.1109/JSTQE.2016.2635518
Copyright Statement Copyright information regarding this work can be found at the following address: http://eprints.nottingham.ac.uk/end_user_agreement.pdf
Additional Information (c) 2016 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.

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Copyright Statement
Copyright information regarding this work can be found at the following address: http://eprints.nottingham.ac.uk/end_user_agreement.pdf





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