Built-in reliability design of a high-frequency SiC MOSFET power module

Li, Jianfeng; Gurpinar, Emre; Lopez Arevalo, Saul; Castellazzi, Alberto; Mills, Liam

Abstract

A high frequency SiC MOSFET-based three-phase, 2-level power module has been designed, simulated, assembled and tested. The design followed a built-in reliability approach, involving extensive finite-element simulation based analysis of the electro-thermo-mechanical strain and stress affecting the switch during both manufacturing and operation: structural simulations were carried out to identify the materials, geometry and sizes of constituent parts which would maximize reliability. Following hardware development, functional tests were carried out, showing that the module is suitable for high switching frequency operation without impairing efficiency, thus enabling a considerable reduction of system-level size and weight.

Citation

Li, J., Gurpinar, E., Lopez Arevalo, S., Castellazzi, A., & Mills, L. Built-in reliability design of a high-frequency SiC MOSFET power module. Presented at 7th International Power Electronics Conference (IPEC Hiroshima 2014 ECCE- ASIA)

• Conference Name: 7th International Power Electronics Conference (IPEC Hiroshima 2014 ECCE- ASIA)
• End Date: May 21, 2014
• Acceptance Date: Jan 6, 2014
• Online Publication Date: Aug 7, 2014
• Deposit Date: Jul 17, 2017
• Publicly Available Date: Jul 17, 2017
• Peer Reviewed: Peer Reviewed
• Keywords: SiC MOSFET, multi-chip power modules, reliability.
• Public URL: https://nottingham-repository.worktribe.com/output/734433
• Publisher URL: http://ieeexplore.ieee.org/document/6870033/
• Related Public URLs: https://www.ieee.org/conferences_events/conferences/conferencedetails/index.html?Conf_ID=32002
• Additional Information: Published in: Proceedings of 2014 International Power Electronics Conference (IPEC Hiroshima 2014 - ECCE-ASIA). IEEE, 2014. ISBN 9781479927067. doi:10.1109/IPEC.2014.6870033 ; ; © 2014 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
• Contract Date: Jul 17, 2017