Testing of a lightweight SiC power module for avionic applications

Gurpinar, Emre; Lopez Arevalo, Saul; Li, Jianfeng; De, D.; Castellazzi, Alberto; Mills, Liam

Abstract

Functional and performance tests of a three-phase, two-level power module based on CREE 1.2kV SiC MOSFETs for avionic applications is presented in this paper. SiC devices have superior properties over conventional Si devices at high voltage operations and these properties make SiC devices at-tractive for avionic industry in order to reduce size of power electronic converters while maintaining high efficiency. This paper starts with a brief explanation of thermo-mechanical de¬sign approach of SiC power module. Thermo-mechanical de¬sign is followed by test setup and experimental results for dif¬ferent load and switching frequency conditions. The module is tested up to 540V DC link voltage, 6kW output power with 100kHz switching frequency. Experimental results show that the module can be successfully operated with high efficiency at high switching frequencies.

Citation

Gurpinar, E., Lopez Arevalo, S., Li, J., De, D., Castellazzi, A., & Mills, L. (in press). Testing of a lightweight SiC power module for avionic applications.

• Conference Name: 7th IET International Conference on Power Electronics, Machines and Drives (PEMD 2014)
• End Date: Apr 10, 2014
• Acceptance Date: Nov 27, 2013
• Online Publication Date: Jun 19, 2014
• Deposit Date: Jul 17, 2017
• Publicly Available Date: Jul 17, 2017
• Peer Reviewed: Peer Reviewed
• Keywords: SiC, silicon carbide, MOSFET, SiC power mod¬ule, high-frequency inverter, three-phase inverter, avionic sys¬tems
• Public URL: https://nottingham-repository.worktribe.com/output/730399
• Related Public URLs: https://www.ieee.org/conferences_events/conferences/conferencedetails/index.html?Conf_ID=30971
• Additional Information: Published in: Proceedings of 7th IET International Conference on Power Electronics, Machines and Drives (PEMD 2014). doi:10.1049/cp.2014.0336.; © 2014 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
• Contract Date: Jul 17, 2017