Dr PEARL AGYAKWA's Outputs (23)

Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules (2013)
Journal Article
Yang, L., Agyakwa, P. A., & Johnson, C. M. (2013). Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules. IEEE Transactions on Device and Materials Reliability, 13(1), https://doi.org/10.1109/TDMR.2012.2235836

This paper presents a review of the commonly adopted physics-of-failure-based life prediction models for wire
bond interconnects in power electronic modules. In the discussed models, lifetime is generally accounted for by loading temperature extreme... Read More about Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules.

Thermal and mechanical design optimization of a pressure-mounted base-plate-less high temperature power module (2010)
Presentation / Conference Contribution
Mattey, N., Skuriat, R., Li, J., Agyakwa, P., Evans, P., & Mark Johnson, C. (2010, September). Thermal and mechanical design optimization of a pressure-mounted base-plate-less high temperature power module. Presented at 3rd Electronics System Integration Technology Conference ESTC, Berlin, Germany

We discuss the mechanical and thermal design of a high temperature pressure-mounted base-plate-less power module for application in a continuous high temperature (150°C) ambient. The thermal resistance of potential thermal interface materials (TIMs)... Read More about Thermal and mechanical design optimization of a pressure-mounted base-plate-less high temperature power module.

Packaging/assembling technologies for a high performance SiC-based planar power module
Presentation / Conference Contribution
Li, J., Agyakwa, P., Evans, P., Johnson, C. M., Zhao, Y., Wu, Y., & Evans, K. Packaging/assembling technologies for a high performance SiC-based planar power module. Presented at Greener Aviation Conference 2014: Clean Sky Breakthrough and Worldwide Status

This work is to investigate the relevant packaging / assembling technologies for developing a SiC-based planar power module which is aimed to meet the requirements such as operating temperature of -60 °C to 200 °C, SiC devices connected to 540 V DC b... Read More about Packaging/assembling technologies for a high performance SiC-based planar power module.