Packaging/assembling technologies for a high performance SiC-based planar power module

Li, Jianfeng; Agyakwa, Pearl; Evans, Paul; Johnson, Christopher Mark; Zhao, Yimin; Wu, Yibo; Evans, Kim

Abstract

This work is to investigate the relevant packaging / assembling technologies for developing a SiC-based planar power module which is aimed to meet the requirements such as operating temperature of -60 °C to 200 °C, SiC devices connected to 540 V DC bus and non-hermetic module. The results reported in this paper include: (i) design of a compact wire-less SiC-based power module with low parasitic inductance; (ii) demonstrated feasibility and reliability for the sintering of Ag nanoparticles and flexible printed circuit board as alternative joining and interconnect technologies which have been selected to assemble the designed power module; and (iii) preliminary construction of the designed module and electrical switching test of the constructed module.

Citation

Li, J., Agyakwa, P., Evans, P., Johnson, C. M., Zhao, Y., Wu, Y., & Evans, K. (in press). Packaging/assembling technologies for a high performance SiC-based planar power module.

• Conference Name: Greener Aviation Conference 2014: Clean Sky Breakthrough and Worldwide Status
• End Date: Mar 14, 2014
• Acceptance Date: Feb 7, 2014
• Deposit Date: Jul 17, 2017
• Peer Reviewed: Peer Reviewed
• Public URL: https://nottingham-repository.worktribe.com/output/723409
• Contract Date: Jul 17, 2017