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Packaging/assembling technologies for a high performance SiC-based planar power module

Li, Jianfeng; Agyakwa, Pearl; Evans, Paul; Johnson, Christopher Mark; Zhao, Yimin; Wu, Yibo; Evans, Kim

Authors

Jianfeng Li

PAUL EVANS paul.evans@nottingham.ac.uk
Associate Professor

MARK JOHNSON mark.johnson@nottingham.ac.uk
Professor of Advancedpower Conversion

Yimin Zhao

Yibo Wu

Kim Evans



Abstract

This work is to investigate the relevant packaging / assembling technologies for developing a SiC-based planar power module which is aimed to meet the requirements such as operating temperature of -60 °C to 200 °C, SiC devices connected to 540 V DC bus and non-hermetic module. The results reported in this paper include: (i) design of a compact wire-less SiC-based power module with low parasitic inductance; (ii) demonstrated feasibility and reliability for the sintering of Ag nanoparticles and flexible printed circuit board as alternative joining and interconnect technologies which have been selected to assemble the designed power module; and (iii) preliminary construction of the designed module and electrical switching test of the constructed module.

Citation

Li, J., Agyakwa, P., Evans, P., Johnson, C. M., Zhao, Y., Wu, Y., & Evans, K. (in press). Packaging/assembling technologies for a high performance SiC-based planar power module

Conference Name Greener Aviation Conference 2014: Clean Sky Breakthrough and Worldwide Status
End Date Mar 14, 2014
Acceptance Date Feb 7, 2014
Deposit Date Jul 17, 2017
Publicly Available Date Nov 30, -0001
Peer Reviewed Peer Reviewed
Public URL http://eprints.nottingham.ac.uk/id/eprint/44168
Copyright Statement Copyright information regarding this work can be found at the following address: http://eprints.nottingh.../end_user_agreement.pdf

Files

Assembling Technologies for a High Performance SiC-Based Planar Power Module.pdf (1.2 Mb)
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Copyright Statement
Copyright information regarding this work can be found at the following address: http://eprints.nottingham.ac.uk/end_user_agreement.pdf





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