Reactive material jetting of polyimide insulators for complex circuit board design
(2018)
Journal Article
Zhang, F., Saleh, E., Vaithilingam, J., Li, Y., Tuck, C., Hague, R., Wildman, R., & He, Y. (2019). Reactive material jetting of polyimide insulators for complex circuit board design. Additive Manufacturing, 25, 477-484. https://doi.org/10.1016/j.addma.2018.11.017
Polyimides are a group of high performance thermal stable dielectric materials used in diverse applications. In this article, we synthesized and developed a high-performance polyimide precursor ink for a Material Jetting (MJ) process. The proposed in... Read More about Reactive material jetting of polyimide insulators for complex circuit board design.