Reactive material jetting of polyimide insulators for complex circuit board design

Zhang, Fan; Saleh, Ehab; Vaithilingam, Jayasheelan; Li, You; Tuck, Christopher; Hague, Richard; Wildman, Ricky; He, Yinfeng

Abstract

Polyimides are a group of high performance thermal stable dielectric materials used in diverse applications. In this article, we synthesized and developed a high-performance polyimide precursor ink for a Material Jetting (MJ) process. The proposed ink formulation was shown to form a uniform and dense polyimide film through reactive MJ utilising real-time thermo-imidisation process. The printed polyimide film showed a permittivity of 3.41 and degradation temperature around 500 °C, both of which are comparable to commercially available polyimide films. Benefiting from the capability of being able to selectively deposit material through MJ, we propose the use of such a formulation to produce complex circuit board structures by the co-printing of conductive silver tracks and polyimide dielectric layers. By means of selectively depositing 4 µm thick patches at the cross-over points of two circuit patterns, a traditional double-sided printed circuit board (PCB) can be printed on one side, providing the user with higher design freedom to achieve a more compact high performance PCB structure.

Citation

Zhang, F., Saleh, E., Vaithilingam, J., Li, Y., Tuck, C., Hague, R., …He, Y. (2019). Reactive material jetting of polyimide insulators for complex circuit board design. Additive Manufacturing, 25, 477-484. https://doi.org/10.1016/j.addma.2018.11.017

• Journal Article Type: Article
• Acceptance Date: Nov 17, 2018
• Online Publication Date: Nov 22, 2018
• Publication Date: Jan 1, 2019
• Deposit Date: Dec 6, 2018
• Publicly Available Date: Dec 11, 2018
• Journal: Additive Manufacturing
• Print ISSN: 2214-7810
• Electronic ISSN: 2214-8604
• Publisher: Elsevier
• Peer Reviewed: Peer Reviewed
• Volume: 25
• Pages: 477-484
• DOI: https://doi.org/10.1016/j.addma.2018.11.017
• Public URL: https://nottingham-repository.worktribe.com/output/1379711
• Publisher URL: https://www.sciencedirect.com/science/article/pii/S2214860418306262?via%3Dihub