Shear strength of die attachments prepared using dry nanosilver film by a time-reduced sintering process
(2020)
Journal Article
This study investigates a time-reduced sintering process for die attachment, prepared, within a processing time of several seconds using dry nanosilver film. The effects of three main sintering parameters, sintering temperature (220 to 300 °C), sinte... Read More about Shear strength of die attachments prepared using dry nanosilver film by a time-reduced sintering process.