1.2 kV SiC Wirebond-Less Integrated Low Inductance Module for Automotive Application
(2023)
Conference Proceeding
De Giorgio, M., Li, K., Marchant, S., de Lillo, L., Empringham, L., Serafianos, D., …Johnson, M. (2023). 1.2 kV SiC Wirebond-Less Integrated Low Inductance Module for Automotive Application. In 2023 IEEE 8th Southern Power Electronics Conference and 17th Brazilian Power Electronics Conference (SPEC/COBEP). https://doi.org/10.1109/spec56436.2023.10408710
In this paper, a 1.2 kV wirebond-less Silicon Carbide (SiC) Intelligent Power Module (IPM) designed for automotive applications is presented. This IPM includes integrated decoupling capacitors and gate drivers. By utilizing Printed Circuit Board (PCB... Read More about 1.2 kV SiC Wirebond-Less Integrated Low Inductance Module for Automotive Application.