All Outputs (5)

Error characteristics of a model-based integration approach for fixed-wing unmanned aerial vehicles (2021)
Journal Article

The paper presents the error characteristics of a vehicle dynamic model (VDM)-based integration architecture for fixed-wing unmanned aerial vehicles. Global navigation satellite system (GNSS) and inertial measurement unit measurements are fused in an... Read More about Error characteristics of a model-based integration approach for fixed-wing unmanned aerial vehicles.

Towards the thermal management of electronic devices: A parametric investigation of finned heat sink filled with PCM (2021)
Journal Article

This study presents the parametric investigation of a phase change material (PCM) filled plate-fin heat sink, used for thermal management (TM) of electronic components. Two-dimensional (2D) unsteady numerical simulations were carried out using the fi... Read More about Towards the thermal management of electronic devices: A parametric investigation of finned heat sink filled with PCM.

Thermal process enhancement of HNCPCM filled heat sink: Effect of hybrid nanoparticles ratio and shape (2021)
Journal Article

The present study based on the numerical investigation of a hybrid nanocomposite phase change material (HNCPCM) filled heat sink for passive cooling of electronic devices. The combination of graphene oxide (GO) and silver (Ag) hybrid nanoparticles ar... Read More about Thermal process enhancement of HNCPCM filled heat sink: Effect of hybrid nanoparticles ratio and shape.

Numerical study of nanocomposite phase change material-based heat sink for the passive cooling of electronic components (2021)
Journal Article

The current two-dimensional (2D) numerical study presents the melting phenomenon and heat transfer performance of the nanocomposite phase change material (NCPCM) based heat sink. Metallic nanoparticles (copper: Cu) of different volume fractions of 0.... Read More about Numerical study of nanocomposite phase change material-based heat sink for the passive cooling of electronic components.

Thermophysical characteristics and enhancement analysis of carbon-additives phase change mono and hybrid materials for thermal management of electronic devices (2021)
Journal Article