Skip to main content

Research Repository

Advanced Search

All Outputs (4)

Towards the thermal management of electronic devices: A parametric investigation of finned heat sink filled with PCM (2021)
Journal Article

This study presents the parametric investigation of a phase change material (PCM) filled plate-fin heat sink, used for thermal management (TM) of electronic components. Two-dimensional (2D) unsteady numerical simulations were carried out using the fi... Read More about Towards the thermal management of electronic devices: A parametric investigation of finned heat sink filled with PCM.

Thermal process enhancement of HNCPCM filled heat sink: Effect of hybrid nanoparticles ratio and shape (2021)
Journal Article

The present study based on the numerical investigation of a hybrid nanocomposite phase change material (HNCPCM) filled heat sink for passive cooling of electronic devices. The combination of graphene oxide (GO) and silver (Ag) hybrid nanoparticles ar... Read More about Thermal process enhancement of HNCPCM filled heat sink: Effect of hybrid nanoparticles ratio and shape.