All Outputs (2)

1.2 kV SiC Wirebond-Less Integrated Low Inductance Module for Automotive Application (2023)
Conference Proceeding
De Giorgio, M., Li, K., Marchant, S., de Lillo, L., Empringham, L., Serafianos, D., …Johnson, M. (2023). 1.2 kV SiC Wirebond-Less Integrated Low Inductance Module for Automotive Application. In 2023 IEEE 8th Southern Power Electronics Conference and 17th Brazilian Power Electronics Conference (SPEC/COBEP). https://doi.org/10.1109/spec56436.2023.10408710

In this paper, a 1.2 kV wirebond-less Silicon Carbide (SiC) Intelligent Power Module (IPM) designed for automotive applications is presented. This IPM includes integrated decoupling capacitors and gate drivers. By utilizing Printed Circuit Board (PCB... Read More about 1.2 kV SiC Wirebond-Less Integrated Low Inductance Module for Automotive Application.

A Topology-Morphing Series Resonant Converter for Photovoltaic Module Applications (2022)
Conference Proceeding
Sergentanis, G., De Lillo, L., Empringham, L., & Johnson, C. M. (2022). A Topology-Morphing Series Resonant Converter for Photovoltaic Module Applications. In 2022 24th European Conference on Power Electronics and Applications (EPE'22 ECCE Europe)

Residential solar photovoltaic (PV) installations frequently use power optimizers to increase their energy production. In this application, the ability to regulate a wide range of voltage with high efficiency is highly desirable. Thus, this paper pro... Read More about A Topology-Morphing Series Resonant Converter for Photovoltaic Module Applications.