A wire-bond-less 10 KV SiC MOSFET power module with reduced common-mode noise and electric field
(2018)
Presentation / Conference Contribution
DiMarino, C., Mouawad, B., Skuriat, R., Li, K., Xu, Y., Johnson, C., Boroyevich, D., & Burgos, R. (2018, June). A wire-bond-less 10 KV SiC MOSFET power module with reduced common-mode noise and electric field. Presented at PCIM 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
While wide-bandgap devices offer many benefits, they also bring new challenges for designers. In particular, the new 10 kV silicon carbide (SiC) MOSFETs can switch higher voltages faster and with lower losses than silicon devices while also being sma... Read More about A wire-bond-less 10 KV SiC MOSFET power module with reduced common-mode noise and electric field.