Using cohesive zone models with digital image correlation to obtain a mixed mode I/II fracture envelope of a tough epoxy
(2023)
Journal Article
This work describes a method in which the digital image correlation (DIC) method and finite element analysis (FEA) were used to create a quasi-static mixed-mode fracture envelope for bonded joints consisting of 2024-T3 Al adherends and a tough struct... Read More about Using cohesive zone models with digital image correlation to obtain a mixed mode I/II fracture envelope of a tough epoxy.