Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure

Zhang, Hui; Li, Jianfeng; Dai, Jingru; Corfield, Martin; Liu, Xuejian; Liu, Yan; Huang, Zhengren; Johnson, Christopher Mark

Abstract

This paper proposes an advanced Si3N4 ceramic-based structure with through vias designed and filled with brazing alloy as a reliable interconnect solution in planar power modules. Finite element (FE) modeling and simulation were first used to predict the potential of using the proposed Si3N4 ceramic-based structure to improve the heat dissipation and reliability of planar interconnects. Power cycling tests and non-destructive microstructural characterization were then performed on Si3N4 ceramic-based structures, flexible printed circuit boards (PCB) and conventional Al wire interconnect samples to evaluate the FE predictions. Both the FE simulations and experimental tests were carried out on single Si diode samples where both the ceramic-based structures and flexible PCBs were bonded on the top sides of Si diodes with eutectic Sn-3.5Ag solder joints. The results obtained demonstrate that Si3N4 ceramic-based structures can significantly improve the reliability of planar interconnects. The experimental average lifetimes and FE simulated maximum creep strain accumulations for the ceramic-based structure and flexible PCB interconnect samples can reasonably be fitted to existing lifetime models for Sn-3.5Ag solder joints. Discrepancies between the models and experimental results can be attributed to defects and poor filling of the brazing alloy in the vias through the Si3N4 ceramic.

Citation

Zhang, H., Li, J., Dai, J., Corfield, M., Liu, X., Liu, Y., Huang, Z., & Johnson, C. M. (2018). Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure. IEEE Journal of Emerging and Selected Topics in Power Electronics, 6(1), 175-187. https://doi.org/10.1109/jestpe.2017.2758901

• Journal Article Type: Article
• Acceptance Date: Sep 25, 2017
• Online Publication Date: Nov 13, 2017
• Publication Date: 2018-03
• Deposit Date: Sep 27, 2017
• Publicly Available Date: Nov 13, 2017
• Journal: IEEE Journal of Emerging and Selected Topics in Power Electronics
• Print ISSN: 2168-6777
• Electronic ISSN: 2168-6785
• Publisher: Institute of Electrical and Electronics Engineers
• Peer Reviewed: Peer Reviewed
• Volume: 6
• Issue: 1
• Pages: 175-187
• DOI: https://doi.org/10.1109/jestpe.2017.2758901
• Keywords: Materials reliability, electronics packaging, planar power module, finite element method, power cycling, X-ray computation tomography
• Public URL: https://nottingham-repository.worktribe.com/output/962521
• Publisher URL: http://ieeexplore.ieee.org/document/8105796/
• Additional Information: ©2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.
• Contract Date: Sep 27, 2017