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Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure

Zhang, Hui; Li, Jianfeng; Dai, Jingru; Corfield, Martin; Liu, Xuejian; Liu, Yan; Huang, Zhengren; Johnson, Christopher Mark

Authors

Hui Zhang

Jianfeng Li

Jingru Dai

Martin Corfield

Xuejian Liu

Yan Liu

Zhengren Huang

Christopher Mark Johnson mark.johnson@nottingham.ac.uk



Abstract

This paper proposes an advanced Si3N4 ceramic-based structure with through vias designed and filled with brazing alloy as a reliable interconnect solution in planar power modules. Finite element (FE) modeling and simulation were first used to predict the potential of using the proposed Si3N4 ceramic-based structure to improve the heat dissipation and reliability of planar interconnects. Power cycling tests and non-destructive microstructural characterization were then performed on Si3N4 ceramic-based structures, flexible printed circuit boards (PCB) and conventional Al wire interconnect samples to evaluate the FE predictions. Both the FE simulations and experimental tests were carried out on single Si diode samples where both the ceramic-based structures and flexible PCBs were bonded on the top sides of Si diodes with eutectic Sn-3.5Ag solder joints. The results obtained demonstrate that Si3N4 ceramic-based structures can significantly improve the reliability of planar interconnects. The experimental average lifetimes and FE simulated maximum creep strain accumulations for the ceramic-based structure and flexible PCB interconnect samples can reasonably be fitted to existing lifetime models for Sn-3.5Ag solder joints. Discrepancies between the models and experimental results can be attributed to defects and poor filling of the brazing alloy in the vias through the Si3N4 ceramic.

Journal Article Type Article
Publication Date 2018-03
Journal IEEE Journal of Emerging and Selected Topics in Power Electronics
Electronic ISSN 2168-6785
Publisher Institute of Electrical and Electronics Engineers
Peer Reviewed Peer Reviewed
Volume 6
Issue 1
Pages 175-187
APA6 Citation Zhang, H., Li, J., Dai, J., Corfield, M., Liu, X., Liu, Y., …Johnson, C. M. (2018). Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure. IEEE Journal of Emerging and Selected Topics in Power Electronics, 6(1), 175-187. https://doi.org/10.1109/jestpe.2017.2758901
DOI https://doi.org/10.1109/jestpe.2017.2758901
Keywords Materials reliability, electronics packaging, planar power module, finite element method, power cycling, X-ray computation tomography
Publisher URL http://ieeexplore.ieee.org/document/8105796/
Copyright Statement Copyright information regarding this work can be found at the following address: http://eprints.nottingh.../end_user_agreement.pdf
Additional Information ©2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.

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Copyright Statement
Copyright information regarding this work can be found at the following address: http://eprints.nottingham.ac.uk/end_user_agreement.pdf





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