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Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure

Zhang, Hui; Li, Jianfeng; Dai, Jingru; Corfield, Martin; Liu, Xuejian; Liu, Yan; Huang, Zhengren; Johnson, Christopher Mark


Hui Zhang

Jianfeng Li

Jingru Dai

Martin Corfield

Xuejian Liu

Yan Liu

Zhengren Huang

Professor of Advanced Power Conversion


This paper proposes an advanced Si3N4 ceramic-based structure with through vias designed and filled with brazing alloy as a reliable interconnect solution in planar power modules. Finite element (FE) modeling and simulation were first used to predict the potential of using the proposed Si3N4 ceramic-based structure to improve the heat dissipation and reliability of planar interconnects. Power cycling tests and non-destructive microstructural characterization were then performed on Si3N4 ceramic-based structures, flexible printed circuit boards (PCB) and conventional Al wire interconnect samples to evaluate the FE predictions. Both the FE simulations and experimental tests were carried out on single Si diode samples where both the ceramic-based structures and flexible PCBs were bonded on the top sides of Si diodes with eutectic Sn-3.5Ag solder joints. The results obtained demonstrate that Si3N4 ceramic-based structures can significantly improve the reliability of planar interconnects. The experimental average lifetimes and FE simulated maximum creep strain accumulations for the ceramic-based structure and flexible PCB interconnect samples can reasonably be fitted to existing lifetime models for Sn-3.5Ag solder joints. Discrepancies between the models and experimental results can be attributed to defects and poor filling of the brazing alloy in the vias through the Si3N4 ceramic.


Zhang, H., Li, J., Dai, J., Corfield, M., Liu, X., Liu, Y., …Johnson, C. M. (2018). Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure. IEEE Journal of Emerging and Selected Topics in Power Electronics, 6(1), 175-187.

Journal Article Type Article
Acceptance Date Sep 25, 2017
Online Publication Date Nov 13, 2017
Publication Date 2018-03
Deposit Date Sep 27, 2017
Publicly Available Date Nov 13, 2017
Journal IEEE Journal of Emerging and Selected Topics in Power Electronics
Electronic ISSN 2168-6785
Publisher Institute of Electrical and Electronics Engineers
Peer Reviewed Peer Reviewed
Volume 6
Issue 1
Pages 175-187
Keywords Materials reliability, electronics packaging, planar power module, finite element method, power cycling, X-ray computation tomography
Public URL
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Additional Information ©2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.


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