Near-Field MIMO Communication Links

Phang, Sendy; Ivrlac, Michel T.; Gradoni, Gabriele; Creagh, Stephen C.; Tanner, Gregor; Nossek, Josef A.

Abstract

© 2004-2012 IEEE. A procedure to achieve near-field multiple input multiple output (MIMO) communication with equally strong channels is demonstrated in this paper. This has applications in near-field wireless communications, such as Chip-to-Chip (C2C) communication or wireless links between printed circuit boards. Designing the architecture of these wireless C2C networks is, however, based on standard engineering design tools. To attain this goal, a network optimization procedure is proposed, which introduces decoupling and matching networks. As a demonstration, this optimization procedure is applied to a 2-by-2 MIMO with dipole antennas. The potential benefits and design trade-offs are discussed for implementation of wireless radio-frequency interconnects in chip-to-chip or device-to-device communication such as in an Internet-of-Things scenario.

Citation

Phang, S., Ivrlac, M. T., Gradoni, G., Creagh, S. C., Tanner, G., & Nossek, J. A. (2018). Near-Field MIMO Communication Links. IEEE Transactions on Circuits and Systems I: Regular Papers, 65(9), 3027-3036. https://doi.org/10.1109/tcsi.2018.2796305

• Journal Article Type: Article
• Acceptance Date: Jan 18, 2018
• Online Publication Date: Feb 12, 2018
• Publication Date: Sep 1, 2018
• Deposit Date: Mar 2, 2018
• Publicly Available Date: Mar 2, 2018
• Journal: IEEE Transactions on Circuits and Systems I: Regular Papers
• Print ISSN: 1549-8328
• Electronic ISSN: 1558-0806
• Publisher: Institute of Electrical and Electronics Engineers
• Peer Reviewed: Peer Reviewed
• Volume: 65
• Issue: 9
• Pages: 3027-3036
• DOI: https://doi.org/10.1109/tcsi.2018.2796305
• Keywords: Impedance matching, antenna arrays, MIMO, device-to-device communication, mutual coupling, near field communication
• Public URL: https://nottingham-repository.worktribe.com/output/911315
• Publisher URL: http://ieeexplore.ieee.org/document/8289332/
• Additional Information: © 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.