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Near-field MIMO communication links

Phang, Sendy; Ivrlac, Michel T.; Gradoni, Gabriele; Creagh, Stephen C.; Tanner, Gregor; Nossek, Josef A.

Authors

Sendy Phang sendy.phang@nottingham.ac.uk

Michel T. Ivrlac

Gabriele Gradoni gabriele.gradoni@nottingham.ac.uk

Stephen C. Creagh stephen.creagh@nottingham.ac.uk

Gregor Tanner gregor.tanner@nottingham.ac.uk

Josef A. Nossek



Abstract

A procedure to achieve near-field multiple input multiple output (MIMO) communication with equally strong channels is demonstrated in this paper. This has applications in near-field wireless communications, such as Chip-to-Chip (C2C) communication or wireless links between printed circuit boards. Designing the architecture of these wireless C2C networks is, however, based on standard engineering design tools. To attain this goal, a network optimization procedure is proposed, which introduces decoupling and matching networks. As a demonstration, this optimization procedure is applied to a 2-by-2 MIMO with dipole antennas. The potential benefits and design trade-offs are discussed for implementation of wireless radio-frequency interconnects in chip-to-chip or device-to-device communication such as in an Internet-of-Things scenario.

Journal Article Type Article
Journal IEEE Transactions on Circuits and Systems I: Regular Papers
Print ISSN 1549-8328
Electronic ISSN 1549-8328
Publisher Institute of Electrical and Electronics Engineers
Peer Reviewed Peer Reviewed
APA6 Citation Phang, S., Ivrlac, M. T., Gradoni, G., Creagh, S. C., Tanner, G., & Nossek, J. A. (in press). Near-field MIMO communication links. IEEE Transactions on Circuits and Systems I: Regular Papers, doi:10.1109/TCSI.2018.2796305
DOI https://doi.org/10.1109/TCSI.2018.2796305
Keywords Impedance matching, antenna arrays, MIMO, device-to-device communication, mutual coupling, near field communication
Publisher URL http://ieeexplore.ieee.org/document/8289332/
Copyright Statement Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by/4.0
Additional Information © 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

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Copyright Statement
Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by/4.0





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