Thermal management of electronics devices with PCMs filled pin-fin heat sinks: a comparison

Arshad, Adeel; Ali, Hafiz Muhammad; Jabbal, Mark; Verdin, P.G.

Abstract

The present paper covers the comparison of two different configurations (square and circular) pinfin heat sinks embedded with two different phase change materials (PCMs) namely paraffin wax and n-eicosane having different thermo-physical properties were carried out for passive cooling of electronic devices. The pin-fins, acting as thermal conductivity enhancers (TCEs), of 2

Citation

Arshad, A., Ali, H. M., Jabbal, M., & Verdin, P. (in press). Thermal management of electronics devices with PCMs filled pin-fin heat sinks: a comparison. International Journal of Heat and Mass Transfer, 117, https://doi.org/10.1016/j.ijheatmasstransfer.2017.10.065

• Journal Article Type: Article
• Acceptance Date: Oct 16, 2017
• Online Publication Date: Nov 5, 2017
• Deposit Date: Oct 30, 2017
• Publicly Available Date: Nov 6, 2018
• Journal: International Journal of Heat and Mass Transfer
• Print ISSN: 0017-9310
• Electronic ISSN: 0017-9310
• Publisher: Elsevier
• Peer Reviewed: Peer Reviewed
• Volume: 117
• DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2017.10.065
• Keywords: Phase Change Materials (PCMs), Thermal Conductivity Enhancers (TCEs), pin-fin Heat Sinks, paraffin wax, n-eicosane, Set Point Temperatures (SPTs)
• Public URL: https://nottingham-repository.worktribe.com/output/893118
• Publisher URL: https://www.sciencedirect.com/science/article/pii/S0017931017329307