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Thermal management of electronics devices with PCMs filled pin-fin heat sinks: a comparison

Arshad, Adeel; Ali, Hafiz Muhammad; Jabbal, Mark; Verdin, P.G.

Authors

Adeel Arshad adeel.arshad@nottingham.ac.uk

Hafiz Muhammad Ali

P.G. Verdin



Abstract

The present paper covers the comparison of two different configurations (square and circular) pinfin heat sinks embedded with two different phase change materials (PCMs) namely paraffin wax and n-eicosane having different thermo-physical properties were carried out for passive cooling of electronic devices. The pin-fins, acting as thermal conductivity enhancers (TCEs), of 2

Citation

Arshad, A., Ali, H. M., Jabbal, M., & Verdin, P. (in press). Thermal management of electronics devices with PCMs filled pin-fin heat sinks: a comparison. International Journal of Heat and Mass Transfer, 117, https://doi.org/10.1016/j.ijheatmasstransfer.2017.10.065

Journal Article Type Article
Acceptance Date Oct 16, 2017
Online Publication Date Nov 5, 2017
Deposit Date Oct 30, 2017
Publicly Available Date Nov 6, 2018
Journal International Journal of Heat and Mass Transfer
Print ISSN 0017-9310
Electronic ISSN 0017-9310
Publisher Elsevier
Peer Reviewed Peer Reviewed
Volume 117
DOI https://doi.org/10.1016/j.ijheatmasstransfer.2017.10.065
Keywords Phase Change Materials (PCMs), Thermal Conductivity Enhancers (TCEs), pin-fin Heat Sinks, paraffin wax, n-eicosane, Set Point Temperatures (SPTs)
Public URL http://eprints.nottingham.ac.uk/id/eprint/47633
Publisher URL https://www.sciencedirect.com/science/article/pii/S0017931017329307
Copyright Statement Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by-nc-nd/4.0

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Copyright Statement
Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by-nc-nd/4.0





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