Development of a low-cost multimodal VR system for engineering design

Roper, Tessa; Lawson, Glyn; Abdullah, Che

Abstract

Virtual Reality technologies are available at a lower cost than ever before. However, such systems are developed mainly for the consumer market, and inaccuracies in spatial judgements may make them unsuitable for specific applications like Engineering Design. There is evidence to suggest that the addition of haptic feedback may improve spatial judgements, but most commercially available haptic systems are impractical and unaffordable outside of specialist research settings and large enterprises. We describe the challenges for developing a multimodal VR system using only low-cost off-the-shelf technologies, and demonstrate a working prototype of a system which aims to overcome these issues.

Citation

Roper, T., Lawson, G., & Abdullah, C. (2017). Development of a low-cost multimodal VR system for engineering design. In DIS '17 Companion: Proceedings of the 2017 ACM Conference Companion Publication on Designing Interactive Systems (293-296). https://doi.org/10.1145/3064857.3079177

• Conference Name: 2017 ACM Conference on Designing Interactive Systems
• Conference Location: Edinburgh, UK
• Start Date: Jun 10, 2017
• End Date: Jun 14, 2017
• Acceptance Date: Apr 11, 2017
• Publication Date: Jun 10, 2017
• Deposit Date: Jul 18, 2017
• Publicly Available Date: Jul 18, 2017
• Peer Reviewed: Peer Reviewed
• Pages: 293-296
• Book Title: DIS '17 Companion: Proceedings of the 2017 ACM Conference Companion Publication on Designing Interactive Systems
• ISBN: 9781450349918
• DOI: https://doi.org/10.1145/3064857.3079177
• Keywords: Virtual Reality; Multimodality; Haptic feedback; Engineering
• Public URL: https://nottingham-repository.worktribe.com/output/865285
• Publisher URL: http://dl.acm.org/citation.cfm?id=3079177
• Related Public URLs: http://dis2017.org/
• Additional Information: Published in: DIS '17 companion : proceedings of the 2017 ACM Conference : companion publication on designing interactive systems. New York : ACM, c2017. ISBN: 978-1-4503-4991-8. pp. 293-296. doi: 10.1145/3064857.3079177