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Full SiC Version of the EDA5 Inverter

Chowdhury, Shajjad; Gurpinar, Emre; Castellazzi, Alberto

Authors

Shajjad Chowdhury eexsc12@nottingham.ac.uk

Emre Gurpinar emre.gurpinar@nottingham.ac.uk

Alberto Castellazzi alberto.castellazzi@nottingham.ac.uk



Abstract

Recently, a novel hybrid multilevel inverter topology, the EDA5, was presented. The novel inverter topology comprises of two floating capacitors and 16 active switches to achieve five-level output voltage waveform and achieves higher efficiency at low-modulation index compared to a five-level Active Neural Point Clamped (5L-ANPC) converter. In this work, a full SiC MOSFET version of the inverter is presented, using commercially available 1200V rated devices. A balanced mix of simulation and experimental results are presented to point out the salient features of the topology. The topology is compared with 5L-ANPC inverter in simulation, and experimentally demonstrated up to 12kW output power with 1kV DC link voltage.

Citation

Chowdhury, S., Gurpinar, E., & Castellazzi, A. (2017). Full SiC Version of the EDA5 Inverter. https://doi.org/10.1109/IFEEC.2017.7992072

Conference Name 2017 IEEE 3rd International Future Energy Electronics Conference and ECCE Asia (IFEEC 2017 ECCE Asia)
Start Date Jun 3, 2017
End Date Jun 7, 2017
Acceptance Date Dec 30, 2016
Online Publication Date Jul 27, 2017
Publication Date Jun 5, 2017
Deposit Date Feb 22, 2017
Publicly Available Date Jun 5, 2017
Publisher Institute of Electrical and Electronics Engineers
Peer Reviewed Peer Reviewed
DOI https://doi.org/10.1109/IFEEC.2017.7992072
Keywords SiC MOSFETs; multilevel converter; hybrid single phase converter
Public URL http://eprints.nottingham.ac.uk/id/eprint/40694
Publisher URL https://ieeexplore.ieee.org/document/7992072/
Related Public URLs http://www.ifeec.tw/
Copyright Statement Copyright information regarding this work can be found at the following address: http://eprints.nottingham.ac.uk/end_user_agreement.pdf
Additional Information © 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

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Copyright Statement
Copyright information regarding this work can be found at the following address: http://eprints.nottingham.ac.uk/end_user_agreement.pdf





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