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Interconnect materials enabling IGBT modules to achieve stable short circuit failure behavior

Li, Jianfeng; Yaqub, Imran; Corfield, Martin; Johnson, Christopher Mark

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Authors

Jianfeng Li

Imran Yaqub

Martin Corfield

MARK JOHNSON MARK.JOHNSON@NOTTINGHAM.AC.UK
Professor of Advanced Power Conversion



Abstract

Insulated gate bipolar transistor (IGBT) modules, which can fail to stable short-circuit mode, have major applications in electricity network-related fields. Sn-3.5Ag solder joints and sintered Ag joints for the die attachment and Mo, Cu, Sn-3.5Ag, Al, and Ag foils for the top side insert (TSI) material in press pack like single IGBT samples have been investigated using overcurrent and current passage tests. The results reveal that Sn-3.5Ag solder joints in combination with Sn-3.5Ag, Al, or Ag foils can be employed to achieve stable short-circuit failure mode, where the best results are achieved with Ag foils. This can be attributed to the formation of conductive networks/channels through the failed IGBT and good alignment between the residual TSI material and the failed IGBT.

Citation

Li, J., Yaqub, I., Corfield, M., & Johnson, C. M. (2017). Interconnect materials enabling IGBT modules to achieve stable short circuit failure behavior. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 7(5), 734-744. https://doi.org/10.1109/TCPMT.2017.2683202

Journal Article Type Article
Acceptance Date Mar 13, 2017
Online Publication Date Apr 6, 2017
Publication Date 2017-05
Deposit Date Mar 22, 2017
Publicly Available Date Mar 29, 2024
Journal IEEE Transactions on Components, Packaging, and Manufacturing Technology
Print ISSN 2156-3950
Electronic ISSN 2156-3985
Publisher Institute of Electrical and Electronics Engineers
Peer Reviewed Peer Reviewed
Volume 7
Issue 5
Pages 734-744
DOI https://doi.org/10.1109/TCPMT.2017.2683202
Keywords Electronics packaging, Failure to short circuit, Finite element analysis, Overcurrent failure, Power module, Scanning electronic microscopy, Semiconductor device packaging
Public URL https://nottingham-repository.worktribe.com/output/854801
Publisher URL http://ieeexplore.ieee.org/document/7893799/
Additional Information (c) 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.

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