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Cold plasma: a new technology to modify wheat flour functionality

Bahrami, Niloufar; Bayliss, Danny; Chope, Gemma; Penson, Simon; Perehinec, Tania; Fisk, Ian D.

Authors

Niloufar Bahrami

Danny Bayliss

Gemma Chope

Simon Penson



Abstract

Atmospheric pressure cold plasma has the potential to modify biological chemistry and modulate physical surface properties. Wheat flour was treated by low levels of cold plasma (air, 15 V and 20 V) for 60 or 120 s. There was no change in the total aerobic bacterial count or total mould count as a result of treatment. Treatment did not impact the concentration of total non-starch lipids, or non-polar and glycolipids. However, treatment did reduce total free fatty acids and phospholipids and was dose dependent. Oxidation markers (hydroperoxide value and head space n-hexanal) increased with treatment time and voltage, which confirmed the acceleration of lipid oxidation. Total proteins were not significantly influenced by treatment although there was a trend towards higher molecular weight fractions which indicated protein oxidation and treated flour did produce a stronger dough. This study confirms the potential of cold plasma as a tool to modify flour functionality.

Journal Article Type Article
Publication Date Jul 1, 2016
Journal Food Chemistry
Print ISSN 0308-8146
Electronic ISSN 0308-8146
Publisher Elsevier
Peer Reviewed Peer Reviewed
Volume 202
Issue 1
APA6 Citation Bahrami, N., Bayliss, D., Chope, G., Penson, S., Perehinec, T., & Fisk, I. D. (2016). Cold plasma: a new technology to modify wheat flour functionality. Food Chemistry, 202(1), https://doi.org/10.1016/j.foodchem.2016.01.113
DOI https://doi.org/10.1016/j.foodchem.2016.01.113
Keywords Wheat, Cold Plasma, Food Processing, Flour Functionality
Publisher URL http://www.sciencedirect.com/science/article/pii/S0308814616301224
Copyright Statement Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by/4.0

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Copyright Statement
Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by/4.0





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