M. Toka�
Interfacial contribution to thickness dependent in-plane anisotropic magnetoresistance
Toka�, M.; Wang, M.; Jaiswal, S.; Rushforth, A. W.; Gallagher, B. L.; Atkinson, D.; Hindmarch, A. T.
Authors
MU WANG Mu.Wang@nottingham.ac.uk
Research Fellow in Antiferromagnetic Spintronics
S. Jaiswal
ANDREW RUSHFORTH andrew.rushforth@nottingham.ac.uk
Associate Professor
B. L. Gallagher
D. Atkinson
A. T. Hindmarch
Abstract
We have studied in-plane anisotropic magnetoresistance (AMR) in cobalt films with overlayers having designed electrically interface transparency. With an electrically opaque cobalt/overlayer interface, the AMR ratio is shown to vary in inverse proportion to the cobalt film thickness; an indication that in-plane AMR is a consequence of anisotropic scattering with both volume and interfacial contributions. The interface scattering anisotropy opposes the volume scattering contribution, causing the AMR ratio to diminish as the cobalt film thickness is reduced. An intrinsic interface effect explains the significantly reduced AMR ratio in ultra-thin films.
Citation
Tokaç, M., Wang, M., Jaiswal, S., Rushforth, A. W., Gallagher, B. L., Atkinson, D., & Hindmarch, A. T. (2015). Interfacial contribution to thickness dependent in-plane anisotropic magnetoresistance. AIP Advances, 5(12), 127108. https://doi.org/10.1063/1.4937556
Journal Article Type | Article |
---|---|
Acceptance Date | Nov 27, 2015 |
Online Publication Date | Dec 7, 2015 |
Publication Date | Dec 7, 2015 |
Deposit Date | Sep 22, 2016 |
Publicly Available Date | Mar 28, 2024 |
Journal | AIP Advances |
Electronic ISSN | 2158-3226 |
Publisher | American Institute of Physics |
Peer Reviewed | Peer Reviewed |
Volume | 5 |
Issue | 12 |
Article Number | 127108 |
Pages | 127108 |
DOI | https://doi.org/10.1063/1.4937556 |
Public URL | https://nottingham-repository.worktribe.com/output/770181 |
Publisher URL | http://scitation.aip.org/content/aip/journal/adva/5/12/10.1063/1.4937556 |
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Copyright Statement
Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by/4.0
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