System condition monitoring through Bayesian change point detection using pump vibrations
(2020)
Conference Proceeding
This paper presents a method for vibration analysis and a simple test bench analogue for the solder pumping system in an industrial wave-soldering machine at a Siemens factory. A common machine fault is caused by solder build-up within the pipes of t... Read More about System condition monitoring through Bayesian change point detection using pump vibrations.