Outputs (95)

Modulated model predictive control for active split DC-bus 4-leg power supply (2017)
Presentation / Conference Contribution
Bifaretti, S., Pipolo, S., Lidozzi, A., Solero, L., Tarisciotti, L., & Zanchetta, P. Modulated model predictive control for active split DC-bus 4-leg power supply. Presented at 2017 IEEE Energy Conversion Congress and Exposition (ECCE)

This paper proposes a constant switching frequency Finite Control Set Model Predictive Control (FCS-MPC), formally Modulated FCS-MPC or M2PC, for a 4-leg inverter having an Active Split DC-bus on the fourth leg. The great advantage of MPC over linear... Read More about Modulated model predictive control for active split DC-bus 4-leg power supply.

ESBC: an enhanced modular multilevel converter with H-bridge front end (2017)
Presentation / Conference Contribution
Amankwah, E., Costabeber, A., Jasim, O., Trainer, D., & Clare, J. C. ESBC: an enhanced modular multilevel converter with H-bridge front end. Presented at 2017 IEEE Energy Conversion Congress and Exposition (ECCE)

This paper presents the Enhanced Series Bridge Converter (ESBC), a hybrid modular multilevel converter with H-bridge front end suitable for high power grid applications. It retains the advantages of other modular multilevel topologies while offering... Read More about ESBC: an enhanced modular multilevel converter with H-bridge front end.

Combining fault location estimates for a multi-tapped distribution line (2017)
Presentation / Conference Contribution
Jahanger, H., Sumner, M., & Thomas, D. W. Combining fault location estimates for a multi-tapped distribution line. Presented at ISGT Europe 2017

Multi-tapped lines are common in integrated power systems and microgrids which supply variable loads between the main source and the main load. Adopting a cost effective and efficient method for fault location is important for fast power recovery and... Read More about Combining fault location estimates for a multi-tapped distribution line.

Co-design/simulation of flip-chip assembly for high voltage IGBT packages (2017)
Presentation / Conference Contribution
Rajaguru, P., Bailey, C., Aliyu, A. M., Castellazzi, A., Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F., Mitchelson, P., & Elliot, A. Co-design/simulation of flip-chip assembly for high voltage IGBT packages. Presented at 23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017

This paper details a co-design and modelling methodology to optimise the flip-chip assembly parameters so that the overall package and system meets performance and reliability specifications for LED lighting applications. A co-design methodology is e... Read More about Co-design/simulation of flip-chip assembly for high voltage IGBT packages.

A new analysis for finding the optimum power rating of low voltage distribution power electronics based on statistics and probabilities (2017)
Presentation / Conference Contribution
Ganjavi, A., Christopher, E., Johnson, C. M., & Clare, J. C. A new analysis for finding the optimum power rating of low voltage distribution power electronics based on statistics and probabilities. Presented at EPE 2017 ECCE Europe

The continuing trend toward heavier load and high penetration of Distribution Generation (DG) units in low voltage rural distribution feeders requires power electronic-based solution alternatives for voltage regulation purposes. The design of power e... Read More about A new analysis for finding the optimum power rating of low voltage distribution power electronics based on statistics and probabilities.

Design and development of a high-density, high-speed 10 kV SiC MOSFET module (2017)
Presentation / Conference Contribution
Di Marino, C., Boroyevich, D., Burgos, R., Johnson, C. M., & Lu, G.-Q. Design and development of a high-density, high-speed 10 kV SiC MOSFET module. Presented at 2017 19th European Conference on Power Electronics and Applications (EPE'17 ECCE Europe)

High-density packaging of fast-switching power semiconductors typically requires low parasitic inductance, high heat extraction, and high thermo-mechanical reliability. High-density packaging of high-voltage power semiconductors, such as 10 kV SiC MO... Read More about Design and development of a high-density, high-speed 10 kV SiC MOSFET module.

Limits, stability and disturbance rejection analysis of voltage control loop strategies for grid forming converters in DC and AC microgrids with high penetration of constant power loads (2017)
Presentation / Conference Contribution
Navarro-Rodríguez, Á., Garcia, P., Cano, J., & Sumner, M. Limits, stability and disturbance rejection analysis of voltage control loop strategies for grid forming converters in DC and AC microgrids with high penetration of constant power loads. Presented at 2017 19th European Conference on Power Electronics and Applications (EPE'17 ECCE Europe),

This paper extensively analyzes the operation limits, system stability and disturbance rejection capability
of the voltage control loops used in master-slave AC and DC Microgrids (MGs). Two different control schemes are studied analytically, simulat... Read More about Limits, stability and disturbance rejection analysis of voltage control loop strategies for grid forming converters in DC and AC microgrids with high penetration of constant power loads.

EMC-oriented multi-conductor equivalent circuit cable models for spice, including transfer impedance coupling and incident field excitation (2017)
Presentation / Conference Contribution
Smartt, C., Basford, M., Greedy, S., Thomas, D., & Sumner, M. (2017, September). EMC-oriented multi-conductor equivalent circuit cable models for spice, including transfer impedance coupling and incident field excitation. Presented at 2017 International Conference on Electromagnetics in Advanced Applications (ICEAA), Verona, Italy

This paper describes the development and application of sophisticated multi-conductor cable bundle models for Spice simulation. The cable models developed include frequency dependent parameters, transfer impedance coupling and incident plane wave exc... Read More about EMC-oriented multi-conductor equivalent circuit cable models for spice, including transfer impedance coupling and incident field excitation.

Integrated design of motor drives using random heuristic optimization for aerospace applications (2017)
Presentation / Conference Contribution
Cheong, B., Giangrande, P., Galea, M., Zanchetta, P., & Wheeler, P. Integrated design of motor drives using random heuristic optimization for aerospace applications. Presented at SAE AeroTech Congress and Exhibition, AEROTECH 2017

High power density for aerospace motor drives is a key factor in the successful realization of the More Electric Aircraft (MEA) concept. An integrated system design approach offers optimization opportunities, which could lead to further improvements... Read More about Integrated design of motor drives using random heuristic optimization for aerospace applications.

Use of optical fibres for multi-parameter monitoringin electrical AC machines (2017)
Presentation / Conference Contribution
Hind, D. M., Gerada, C., Galea, M., Borg Bartalo, J., Fabian, M., Sun, T., & Grattan, K. T. (2017, August). Use of optical fibres for multi-parameter monitoringin electrical AC machines. Presented at IEEE 11th International Symposium on Diagnostics for Electrical Machines, Power Electronics and Drives (SDEMPED 2017)

This paper describes a new approach to multi-parameter monitoring for electrical AC machines. It is demonstrated that speed, torque and temperature can be measured using optical fibres incorporating sensors in the form of fibre Bragg gratings (FBGs)... Read More about Use of optical fibres for multi-parameter monitoringin electrical AC machines.