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An investigation on thermoelastic damping of high-Q ring resonators

Hossain, Syed T.; McWilliam, Stewart; Popov, Atanas A.

Authors

Syed T. Hossain

ATANAS POPOV ATANAS.POPOV@NOTTINGHAM.AC.UK
Professor of Engineering Dynamics



Abstract

For applications requiring high performance angular rate measurements it is important to be able to design MEMS rate sensors with high quality factors (Q). This paper considers ring resonator based rate sensors and investigates the influence of design changes to the ring and support legs on thermoelastic damping, which is the dominant dissipation mechanism. A computational method is used to quantify the thermoelastic damping and a detailed parameter study is conducted to understand the influence of ring geometry, support legs and micro-machined slots around the ring circumference. The results show that damping in the support legs can have significant influence on the total energy dissipated from the resonator, and the optimum leg geometry can be identified to achieve high Q. It is also observed that the addition of slots improves Q for resonators having higher energy loss. However, for high-Q, rings slots have a detrimental effect. The results presented are useful for designing ring resonators with reduced levels of damping.

Citation

Hossain, S. T., McWilliam, S., & Popov, A. A. (2016). An investigation on thermoelastic damping of high-Q ring resonators. International Journal of Mechanical Sciences, 106, 209-219. https://doi.org/10.1016/j.ijmecsci.2015.12.023

Journal Article Type Article
Acceptance Date Dec 18, 2015
Online Publication Date Dec 30, 2015
Publication Date 2016-02
Deposit Date Sep 18, 2017
Publicly Available Date Mar 29, 2024
Journal International Journal of Mechanical Sciences
Print ISSN 0020-7403
Electronic ISSN 0020-7403
Publisher Elsevier
Peer Reviewed Peer Reviewed
Volume 106
Pages 209-219
DOI https://doi.org/10.1016/j.ijmecsci.2015.12.023
Keywords Thermoelastic damping; Ring resonator; Rate gyro; Quality factor; MEMS device
Public URL https://nottingham-repository.worktribe.com/output/978332
Publisher URL http://www.sciencedirect.com/science/article/pii/S0020740315004506

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