Thermal design and characterization of a modular integrated liquid cooled 1200 V-35 A SiC MOSFET bi-directional switch

Cova, P.; Aliyu, Attahir Murtala; Castellazzi, Alberto; Chiozzi, D.; Delmonte, N.; Lasserre, P.; Pignoloni, N.

Abstract

The aim of this work is the thermal design of a modular direct liquid cooled package for 1200 V–35 A SiC power MOSFETs, in order to take full advantage of the high power density and high frequency performance of these devices, in the development of a modular integrated solution for power converters. An accurate electro-thermal fluid dynamic model is set up and validated by thermal characterization on a prototype; numerical models have been used to study the internal temperature distribution and to propose further optimization.

Citation

Cova, P., Aliyu, A. M., Castellazzi, A., Chiozzi, D., Delmonte, N., Lasserre, P., & Pignoloni, N. (in press). Thermal design and characterization of a modular integrated liquid cooled 1200 V-35 A SiC MOSFET bi-directional switch. Microelectronics Reliability, 76-77, https://doi.org/10.1016/j.microrel.2017.06.062

• Journal Article Type: Article
• Acceptance Date: Jun 26, 2017
• Online Publication Date: Jul 8, 2017
• Deposit Date: Jul 17, 2017
• Publicly Available Date: Jul 17, 2017
• Journal: Microelectronics Reliability
• Print ISSN: 0026-2714
• Electronic ISSN: 0026-2714
• Publisher: Elsevier
• Peer Reviewed: Peer Reviewed
• Volume: 76-77
• DOI: https://doi.org/10.1016/j.microrel.2017.06.062
• Keywords: High power density; Packaging; System integration; Thermal design; Liquid cooling
• Public URL: https://nottingham-repository.worktribe.com/output/872006
• Publisher URL: http://www.sciencedirect.com/science/article/pii/S0026271417302500?via%3Dihub
• Contract Date: Jul 17, 2017