P. Cova
Thermal design and characterization of a modular integrated liquid cooled 1200 V-35 A SiC MOSFET bi-directional switch
Cova, P.; Aliyu, Attahir Murtala; Castellazzi, Alberto; Chiozzi, D.; Delmonte, N.; Lasserre, P.; Pignoloni, N.
Authors
Attahir Murtala Aliyu
Alberto Castellazzi
D. Chiozzi
N. Delmonte
P. Lasserre
N. Pignoloni
Abstract
The aim of this work is the thermal design of a modular direct liquid cooled package for 1200 V–35 A SiC power MOSFETs, in order to take full advantage of the high power density and high frequency performance of these devices, in the development of a modular integrated solution for power converters. An accurate electro-thermal fluid dynamic model is set up and validated by thermal characterization on a prototype; numerical models have been used to study the internal temperature distribution and to propose further optimization.
Citation
Cova, P., Aliyu, A. M., Castellazzi, A., Chiozzi, D., Delmonte, N., Lasserre, P., & Pignoloni, N. (in press). Thermal design and characterization of a modular integrated liquid cooled 1200 V-35 A SiC MOSFET bi-directional switch. Microelectronics Reliability, 76-77, https://doi.org/10.1016/j.microrel.2017.06.062
Journal Article Type | Article |
---|---|
Acceptance Date | Jun 26, 2017 |
Online Publication Date | Jul 8, 2017 |
Deposit Date | Jul 17, 2017 |
Publicly Available Date | Jul 17, 2017 |
Journal | Microelectronics Reliability |
Print ISSN | 0026-2714 |
Electronic ISSN | 0026-2714 |
Publisher | Elsevier |
Peer Reviewed | Peer Reviewed |
Volume | 76-77 |
DOI | https://doi.org/10.1016/j.microrel.2017.06.062 |
Keywords | High power density; Packaging; System integration; Thermal design; Liquid cooling |
Public URL | https://nottingham-repository.worktribe.com/output/872006 |
Publisher URL | http://www.sciencedirect.com/science/article/pii/S0026271417302500?via%3Dihub |
Contract Date | Jul 17, 2017 |
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Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by-nc-nd/4.0
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