Modular plug-in high-performance assembly of a power converter

Solomon, Adane Kassa; Castellazzi, Alberto; Delmonte, N.; Cova, P.

Abstract

This paper presents the work on an alternative integration scheme for a half-bridge switch using 70 μm thin Si IGBTs and diodes addressing higher strength, higher toughness and higher thermal conductivity. The switch is totally bond wireless, since bonded wires increase self-heating and introduce further thermomechanical degradation mechanisms. Moreover, this solution is equipped with double side liquid cooling, and plug-in edge connectors both on the driver and load sides, allowing high power density, good accessibility and modularity. Preliminary experimental results show good switching behavior.

Citation

Solomon, A. K., Castellazzi, A., Delmonte, N., & Cova, P. Modular plug-in high-performance assembly of a power converter. Presented at 18th European Conference on Power Electronics and Applications

• Conference Name: 18th European Conference on Power Electronics and Applications
• End Date: Sep 9, 2016
• Acceptance Date: Jun 23, 2016
• Publication Date: Sep 7, 2016
• Deposit Date: Jan 19, 2017
• Publicly Available Date: Jan 19, 2017
• Peer Reviewed: Peer Reviewed
• Keywords: High power density, Packaging, System integration, Inverter, Thermal design
• Public URL: https://nottingham-repository.worktribe.com/output/818813
• Related Public URLs: http://www.epe2016.com/
• Contract Date: Jan 19, 2017