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Modular plug-in high-performance assembly of a power converter

Solomon, Adane Kassa; Castellazzi, Alberto; Delmonte, N.; Cova, P.

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Adane Kassa Solomon

Alberto Castellazzi

N. Delmonte

P. Cova


This paper presents the work on an alternative integration scheme for a half-bridge switch using 70 ?m thin Si IGBTs and diodes addressing higher strength, higher toughness and higher thermal conductivity. The switch is totally bond wireless, since bonded wires increase self-heating and introduce further thermomechanical degradation mechanisms. Moreover, this solution is equipped with double side liquid cooling, and plug-in edge connectors both on the driver and load sides, allowing high power density, good accessibility and modularity. Preliminary experimental results show good switching behavior.

Conference Name 18th European Conference on Power Electronics and Applications
End Date Sep 9, 2016
Acceptance Date Jun 23, 2016
Publication Date Sep 7, 2016
Deposit Date Jan 19, 2017
Publicly Available Date Jan 19, 2017
Peer Reviewed Peer Reviewed
Keywords High power density, Packaging, System integration, Inverter, Thermal design
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